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Language: English

Author

Jaeger, Richard C.

(5)

Wiley InterScience (Online service)

(4)

Blalock, Travis N.

(3)

SpringerLink (Online service)

(3)

?saka, Tetsuya, 1945-

(1)

Ahsan, Tanweer, editor.

(1)

American Chemical Society. Division of Polymeric Materials: Science and Engineering.

(1)

Baker, R. Jacob, 1964-

(1)

Ballantyne, J. P.

(1)

Bhushan, Manjul. author.

(1)

Blalock, Travis N., ort. yaz.

(1)

Brand, Oliver. author.

(1)

Brewer, George Raymond, 1922-

(1)

Cheeke, J. David N.

(1)

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

(1)

Elst, Günter. editor.

(1)

Fleetwood, Daniel.

(1)

(1)

Gutmann, Ronald J.

(1)

Hanke, Randolf. editor.

(1)

Heuberger, Albert. editor.

(1)

Horie, Kazuyuki, 1941-

(1)

Iniewski, Krzysztof.

(1)

Ito, Hiroshi, ed.

(1)

Jim�enez, J. (Juan)

(1)

(1)

John Wiley & Sons.

(1)

Karimi-Ghartemani, Masoud, author.

(1)

Ketchen, Mark B. author.

(1)

(1)

Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group.

(1)

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

Makabe, T. (Toshiaki)

(1)

Makabe, T. (Toshiaki), author.

(1)

Marcus, P. (Philippe), 1953-

(1)

Mayer, Michael. author.

(1)

Mittal, K. L., 1945- editor.

(1)

(1)

Pantelides, Sokrates T.

(1)

Pecht, Michael.

(1)

(1)

Petrovi¿̐ưc, Z., author.

(1)

Puttlitz, Karl J.

(1)

Ramaswami, Sesh.

(1)

Rossnagel, Stephen M.

(1)

Ruska, W. Scot.

(1)

Schrimpf, Ronald Donald.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Sedra, Adel S., author.

(1)

(1)

Smith, Kenneth C. (Kenneth Carless), author.

(1)

Stalter, Kathleen A.

(1)

Steigerwald, Joseph M.

(1)

Suganuma, Katsuaki, editor.

(1)

Tagawa, Seichi, ed.

(1)

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

(1)

Yang, Edward S.

(1)

Publication Date

-

(8)

(3)

(3)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Microelectronic packaging.

(9)

Integrated circuits -- Design and construction.

(6)

Semiconductors -- Design and construction.

(5)

Electronic circuit design.

(3)

Microelectronics.

(3)

Chemical mechanical planarization.

(2)

Electronic packaging.

(2)

(2)

Microelectromechanical systems.

(2)

Microelectronics -- Materials.

(2)

Mikroelektronik.

(2)

MİKROELEKTRONİK.

(2)

Optical materials.

(2)

Plasma engineering.

(2)

Systems engineering.

(2)

İNTEGRE DEVRELER -- ÇİZİM VE YAPIM.

(2)

Adhesive joints.

(1)

(1)

(1)

Chip scale packaging.

(1)

Computer network architectures.

(1)

Computer science.

(1)

Corrosion and anti-corrosives.

(1)

Electric connectors.

(1)

Electric power systems -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic circuits.

(1)

Elektronenstrahllithographie.

(1)

Elektronik devreler.

(1)

(1)

Environmental protection.

(1)

Green products.

(1)

Grinding and polishing.

(1)

High power lasers.

(1)

ISI -- İLETİM.

(1)

Integrated circuits -- Defects.

(1)

Integrated circuits -- Very large scale integration -- Design and construction -- Textbooks.

(1)

Integrated circuits industry.

(1)

Lithography, Electron beam.

(1)

Metal oxide semiconductor field-effect transistors -- Testing.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microelectronics -- Materials -- Congresses.

(1)

Microelectronics -- Materials -- Testing.

(1)

Microprogramming.

(1)

Mikroelektronik -- Maddele -- Kongreler.

(1)

Multichip modules (Microelectronics)

(1)

(1)

Nanostructured materials.

(1)

Nanotechnology.

(1)

Optoelectronic devices.

(1)

Passive components.

(1)

Phase-locked loops.

(1)

Photoluminescence.

(1)

(1)

Polymers -- Congresses.

(1)

Power electronics.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

Semiconductor lasers.

(1)

Software engineering.

(1)

Solder and soldering.

(1)

Strains and stresses -- Measurement.

(1)

(1)

Thin films -- Computer simulation -- Congresses.

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Ultrasonic waves -- Industrial applications.

(1)

Ultrasonic waves.

(1)

Wide gap semiconductors.

(1)

YARIİLETKENLER -- ÇİZİM VE YAPIM.

(1)

YARIİLETKENLER.

(1)

Material Type

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25.

Cover image for CMOS circuit design, layout, and simulation

CMOS circuit design, layout, and simulation

CMOS circuit design, layout, and simulation

Author

Baker, R. Jacob, 1964- Wiley InterScience (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

Wiley InterScience An electronic book accessible through the World Wide Web; click for information

Format:

Availability

Online Library~1

Available:
Copies:

26.

Cover image for Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Wide Bandgap Power Semiconductor Packaging : Materials, Components, and Reliability

Author

Suganuma, Katsuaki, editor.

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect https://www.sciencedirect.com/science/book/9780081020944

Format:

Availability

Online Library~1

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27.

Cover image for Adhesion in microelectronics

Adhesion in microelectronics

Adhesion in microelectronics

Author

Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.

Preferred Shelf Number

ONLINE(341844.1)

Electronic Access

ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373

Format:

Availability

Online Library~1

Available:
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28.

Cover image for MEMS fundamental technology and applications

MEMS fundamental technology and applications

MEMS fundamental technology and applications

Author

Choudhary, Vikas. Iniewski, Krzysztof.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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29.

Cover image for Semiconductor packaging materials interaction and reliability

Semiconductor packaging materials interaction and reliability

Semiconductor packaging materials interaction and reliability

Author

Chen, Andrea. Lo, Randy.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

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Online Library~1

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Copies:

30.

Cover image for Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Author

Cheeke, J. David N.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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31.

Cover image for Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Author

Marcus, P. (Philippe), 1953-

Preferred Shelf Number

ONLINE

Electronic Access

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32.

Cover image for 3D IC stacking technology

3D IC stacking technology

3D IC stacking technology

Author

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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33.

Cover image for Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Author

Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

Preferred Shelf Number

ONLINE

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34.

Cover image for Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Author

Tomm, Jens W. Jim�enez, J. (Juan)

Preferred Shelf Number

ONLINE

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Subscription required

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35.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

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Subscription required

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36.

Cover image for IC component sockets

IC component sockets

IC component sockets

Author

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Preferred Shelf Number

ONLINE

Electronic Access

John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

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1 2 3

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