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25. 
Cover image for Electrical Conductive Adhesives with Nanotechnologies
Electrical Conductive Adhesives with Nanotechnologies
Author 
Li, Yi. author. Lu, Daniel. author. Wong, C. P. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-88783-8
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26. 
Cover image for Nanoscale Magnetic Materials and Applications
Nanoscale Magnetic Materials and Applications
Author 
Liu, J. Ping. editor. Fullerton, Eric. editor. Gutfleisch, Oliver. editor. Sellmyer, D.J. editor. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-0-387-85600-1
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27. 
Cover image for Smart Materials for Energy, Communications and Security
Smart Materials for Energy, Communications and Security
Author 
Luk'yanchuk, Igor A. editor. Mezzane, Daoud. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8796-7
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28. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4589-1
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