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25. 
Cover image for New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
New Trends in Networking, Computing, E-learning, Systems Sciences, and Engineering
Author 
Elleithy, Khaled. editor. Sobh, Tarek. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06764-3
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26. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-15407-7
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27. 
Cover image for Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Ultra-Low-Voltage Design of Energy-Efficient Digital Circuits
Author 
Reynders, Nele. author. Dehaene, Wim. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-16136-5
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28. 
Cover image for Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Wafer-Level Chip-Scale Packaging Analog and Power Semiconductor Applications
Author 
Qu, Shichun. author. Liu, Yong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-1556-9
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29. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-09647-6
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30. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Author 
Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-06773-5
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31. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8054-9
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32. 
Cover image for Smart Sensors for Real-Time Water Quality Monitoring
Smart Sensors for Real-Time Water Quality Monitoring
Author 
Mukhopadhyay, Subhas C. editor. Mason, Alex. editor. SpringerLink (Online service)
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ONLINE(334340.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-37006-9
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33. 
Cover image for Anwendungsorientierte Mikroprozessoren Mikrocontroller und Digitale Signalprozessoren
Anwendungsorientierte Mikroprozessoren Mikrocontroller und Digitale Signalprozessoren
Author 
Bähring, Helmut. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-12292-7
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34. 
Cover image for ECODESIGN -- The Competitive Advantage
ECODESIGN -- The Competitive Advantage
Author 
Wimmer, Wolfgang. author. Lee, Kun-Mo. author. Quella, Ferdinand. author. Polak, John. author. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-90-481-9127-7
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35. 
Cover image for Embedded Memories for Nano-Scale VLSIs
Embedded Memories for Nano-Scale VLSIs
Author 
Zhang, Kevin. editor. SpringerLink (Online service)
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Electronic Access 
http://dx.doi.org/10.1007/978-0-387-88497-4
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36. 
Cover image for Memories in Wireless Systems
Memories in Wireless Systems
Author 
Micheloni, Rino. editor. Campardo, Giovanni. editor. Olivo, Piero. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-79078-5
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