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25. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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26. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6348-2
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27. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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28. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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29. 
Cover image for Measurement Uncertainty An Approach via the Mathematical Theory of Evidence
Measurement Uncertainty An Approach via the Mathematical Theory of Evidence
Author 
Salicone, Simona. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-46328-5
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30. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
Author 
Veendrick, Harry. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-64249-4
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31. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-80023-8
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32. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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33. 
Cover image for Detection of Corona Discharge in Electric Networks
Detection of Corona Discharge in Electric Networks
Author 
Sokol, Yevgen. editor. Babak, Vitalii. editor. Zaporozhets, Artur. editor. (orcid)0000-0002-0704-4116 Gryb, Oleg. editor. Karpaliuk, Ihor. editor.
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https://doi.org/10.1007/978-3-031-44025-0
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34. 
Cover image for Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Author 
Pietrenko-Dabrowska, Anna. author. Koziel, Slawomir. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-43845-5
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35. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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36. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
Author 
Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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