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25. 
Cover image for Predictive Technology Model for Robust Nanoelectronic Design
Predictive Technology Model for Robust Nanoelectronic Design
Author 
Cao, Yu. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0445-3
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26. 
Cover image for Trends in Nanophysics Theory, Experiment and Technology
Trends in Nanophysics Theory, Experiment and Technology
Author 
Bârsan, Victor. editor. Aldea, Alexandru. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-12070-1
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27. 
Cover image for Nanometer Technology Designs High-Quality Delay Tests
Nanometer Technology Designs High-Quality Delay Tests
Author 
Tehranipoor, Mohammad. author. Ahmed, Nisar. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-75728-5
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28. 
Cover image for AmIware Hardware Technology Drivers of Ambient Intelligence
AmIware Hardware Technology Drivers of Ambient Intelligence
Author 
Mukherjee, Satyen. editor. Aarts, Ronald M. editor. Roovers, Raf. editor. Widdershoven, Frans. editor. Ouwerkerk, Martin. editor.
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http://dx.doi.org/10.1007/1-4020-4198-5
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29. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138987
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30. 
Cover image for Optical Near-Field Recording Science and Technology
Optical Near-Field Recording Science and Technology
Author 
Tominaga, Junji. author. Nakano, Takashi. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138235
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31. 
Cover image for Proceedings of Second International Conference in Mechanical and Energy Technology ICMET 2021, India
Proceedings of Second International Conference in Mechanical and Energy Technology ICMET 2021, India
Author 
Yadav, Sanjay. editor. Haleem, Abid. editor. Arora, P. K. editor. Kumar, Harish. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-0108-9
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32. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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33. 
Cover image for Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Industry Interactive Innovations in Science, Engineering and Technology Proceedings of the International Conference, I3SET 2016
Author 
Bhattacharyya, Swapan. editor. Sen, Sabyasachi. editor. Dutta, Meghamala. editor. Biswas, Papun. editor. Chattopadhyay, Himadri. editor.
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https://doi.org/10.1007/978-981-10-3953-9
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34. 
Cover image for MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development
MEMS Product Engineering Handling the Diversity of an Emerging Technology. Best Practices for Cooperative Development
Author 
Ortloff, Dirk. author. Schmidt, Thilo. author. Hahn, Kai. author. Bieniek, Tomasz. author. Janczyk, Grzegorz. author.
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https://doi.org/10.1007/978-3-7091-0706-5
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35. 
Cover image for Convergence of Knowledge, Technology and Society Beyond Convergence of Nano-Bio-Info-Cognitive Technologies
Convergence of Knowledge, Technology and Society Beyond Convergence of Nano-Bio-Info-Cognitive Technologies
Author 
Roco, Mihail C. editor. Bainbridge, William S. editor. Tonn, Bruce. editor. Whitesides, George. editor. SpringerLink (Online service)
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ONLINE(332905.1)
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http://dx.doi.org/10.1007/978-3-319-02204-8
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36. 
Cover image for Biomimetics Bioinspired Hierarchical-Structured Surfaces for Green Science and Technology
Biomimetics Bioinspired Hierarchical-Structured Surfaces for Green Science and Technology
Author 
Bhushan, Bharat. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-25408-6
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