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25. 
Cover image for Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Facing the Multicore-Challenge III Aspects of New Paradigms and Technologies in Parallel Computing
Author 
Keller, Rainer. editor. Kramer, David. editor. Weiss, Jan-Philipp. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(334079.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-35893-7
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26. 
Cover image for Embedded Systems for Smart Appliances and Energy Management
Embedded Systems for Smart Appliances and Energy Management
Author 
Grimm, Christoph. editor. Neumann, Peter. editor. Mahlknecht, Stefan. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330846.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8795-2
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27. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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28. 
Cover image for A Practical Introduction to Hardware/Software Codesign
A Practical Introduction to Hardware/Software Codesign
Author 
Schaumont, Patrick R. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331370.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3737-6
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29. 
Cover image for An ASIC Low Power Primer Analysis, Techniques and Specification
An ASIC Low Power Primer Analysis, Techniques and Specification
Author 
Chadha, Rakesh. author. Bhasker, J. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331464.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-4271-4
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30. 
Cover image for Energy-aware Scheduling on Multiprocessor Platforms
Energy-aware Scheduling on Multiprocessor Platforms
Author 
Li, Dawei. author. Wu, Jie. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331714.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5224-9
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31. 
Cover image for Designing TSVs for 3D Integrated Circuits
Designing TSVs for 3D Integrated Circuits
Author 
Khan, Nauman. author. Hassoun, Soha. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331791.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-5508-0
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