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25. 
Cover image for Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Physik der Halbleiterbauelemente Einführendes Lehrbuch für Ingenieure und Physiker
Author 
Thuselt, Frank. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/b138004
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26. 
Cover image for Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Werkstoffkunde für Ingenieure Grundlagen, Anwendung, Prüfung
Author 
Roos, Eberhard. author. Maile, Karl. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138047
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27. 
Cover image for Nanomaterials Imaging Techniques, Surface Studies, and Applications Selected Proceedings of the FP7 International Summer School Nanotechnology: From Fundamental Research to Innovations, August 26-September 2, 2012, Bukovel, Ukraine
Nanomaterials Imaging Techniques, Surface Studies, and Applications Selected Proceedings of the FP7 International Summer School Nanotechnology: From Fundamental Research to Innovations, August 26-September 2, 2012, Bukovel, Ukraine
Author 
Fesenko, Olena. editor. Yatsenko, Leonid. editor. Brodin, Mikhaylo. editor. SpringerLink (Online service)
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ONLINE(332321.1)
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http://dx.doi.org/10.1007/978-1-4614-7675-7
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28. 
Cover image for Biofilm Highlights
Biofilm Highlights
Author 
Flemming, Hans-Curt. editor. Wingender, Jost. editor. Szewzyk, Ulrich. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19940-0
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29. 
Cover image for Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
Narrow Gap Semiconductors 2007 Proceedings of the 13th International Conference, 8–12 July, 2007, Guildford, UK
Author 
Murdin, Ben. editor. Clowes, Steve. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8425-6
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30. 
Cover image for Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method
Author 
Seok, Seonho. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-77872-3
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31. 
Cover image for Dynamics of Gas-Surface Interactions Atomic-level Understanding of Scattering Processes at Surfaces
Dynamics of Gas-Surface Interactions Atomic-level Understanding of Scattering Processes at Surfaces
Author 
Díez Muiño, Ricardo. editor. Busnengo, Heriberto Fabio. editor. SpringerLink (Online service)
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ONLINE(333638.1)
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http://dx.doi.org/10.1007/978-3-642-32955-5
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32. 
Cover image for Attosecond Physics Attosecond Measurements and Control of Physical Systems
Attosecond Physics Attosecond Measurements and Control of Physical Systems
Author 
Plaja, Luis. editor. Torres, Ricardo. editor. Zaïr, Amelle. editor. SpringerLink (Online service)
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ONLINE(334463.1)
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http://dx.doi.org/10.1007/978-3-642-37623-8
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33. 
Cover image for Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Optical Absorption of Impurities and Defects in Semiconducting Crystals Electronic Absorption of Deep Centres and Vibrational Spectra
Author 
Pajot, Bernard. author. Clerjaud, Bernard. author. SpringerLink (Online service)
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ONLINE(333081.1)
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http://dx.doi.org/10.1007/978-3-642-18018-7
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34. 
Cover image for Laser-Assisted Fabrication of Materials
Laser-Assisted Fabrication of Materials
Author 
Majumdar, Jyotsna Dutta. editor. Manna, Indranil. editor. SpringerLink (Online service)
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ONLINE(333178.1)
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http://dx.doi.org/10.1007/978-3-642-28359-8
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35. 
Cover image for HPHT-Treated Diamonds Diamonds Forever
HPHT-Treated Diamonds Diamonds Forever
Author 
Dobrinets, Inga A. author. Vins, Victor. G. author. Zaitsev, Alexander M. author. SpringerLink (Online service)
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ONLINE(334441.1)
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http://dx.doi.org/10.1007/978-3-642-37490-6
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36. 
Cover image for Liquid Crystalline Semiconductors Materials, properties and applications
Liquid Crystalline Semiconductors Materials, properties and applications
Author 
Bushby, Richard J. editor. Kelly, Stephen M. editor. O'Neill, Mary. editor. SpringerLink (Online service)
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ONLINE(335654.1)
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http://dx.doi.org/10.1007/978-90-481-2873-0
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