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Feng, Zhe Chuan.
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1. 
Cover image for VLSI technology
VLSI technology
Author 
Chen, Wai-Kai, 1936-
Preferred Shelf Number 
TK7874.75 .V585 2003
Electronic Access 
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2. 
Cover image for The physical properties of thin metal films
The physical properties of thin metal films
Author 
Zhigal'skii, G. P., editor. Jones, Brian K., 1938- editor.
Preferred Shelf Number 
TN690 .Z458 2003 EB
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780367801113
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for The mechatronics handbook
The mechatronics handbook
Author 
Bishop, Robert H., 1957- ISA--The Instrumentation, Systems, and Automation Society.
Preferred Shelf Number 
TJ163.12 .M434 2002
Electronic Access 
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4. 
Cover image for Conjugated polymer and molecular interfaces : science and technology for photonic and optoelectronic applications
Conjugated polymer and molecular interfaces : science and technology for photonic and optoelectronic applications
Author 
Salaneck, W. R.
Preferred Shelf Number 
TA1750 .C68 2002
Electronic Access 
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5. 
Cover image for Electronic systems maintenance handbook
Electronic systems maintenance handbook
Author 
Whitaker, Jerry C.
Preferred Shelf Number 
TK7870 .E212 2002
Electronic Access 
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6. 
Cover image for Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Advances in Thermotropic Liquid Crystal Polymers : Thin-Film Polymerization, Characterization, Blends and Applications.
Author 
Chung, Tai-shung, author. CRC Press.
Preferred Shelf Number 
TP1180 .P666 T48 2001
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9780367800864
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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7. 
Cover image for Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Applied materials science : applications of engineering materials in structural, electronics, thermal, and other industries
Author 
Chung, Deborah D. L., author.
Preferred Shelf Number 
TA403 .C47 2001
Electronic Access 
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8. 
Cover image for Chemical mechanical planarization of microelectronic materials
Chemical mechanical planarization of microelectronic materials
Author 
Steigerwald, Joseph M. Murarka, S. P. Gutmann, Ronald J. Wiley InterScience (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527617746
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley041/96006198.html
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9. 
Cover image for Polymeric materials for microelectronic applications : science and technology
Polymeric materials for microelectronic applications : science and technology
Author 
Ito, Hiroshi, ed. Tagawa, Seichi, ed. Horie, Kazuyuki, 1941- Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group. American Chemical Society. Division of Polymeric Materials: Science and Engineering.
Preferred Shelf Number 
TK 7871.15.P6 P59 1994
Format: 
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10. 
Cover image for Polymers for microelectronics : resists and dielectrics
Polymers for microelectronics : resists and dielectrics
Author 
Thompson, L. F., 1944- Willson, C. G. (C. Grant) 1939- Tagawa, Seiichi.
Preferred Shelf Number 
TK7871.15.P6 P65 1994
Format: 
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11. 
Cover image for Dry etching for microelectronics
Dry etching for microelectronics
Author 
Powell, Ronald A.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444869050
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