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1. 
Cover image for EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
EMERGING SUSTAINABLE AND RENEWABLE COMPOSITES from packaging to electronics.
Author 
Atiqah, A.
Preferred Shelf Number 
TA418.9 .C6
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003408215
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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2. 
Cover image for Green innovations for industrial development and business sustainability : models and implementation strategies
Green innovations for industrial development and business sustainability : models and implementation strategies
Author 
Sharma, Ravindra (Professor of management), editor. Rana, Geeta, editor. Agarwal, Shivani, editor.
Preferred Shelf Number 
HC79 .T4
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003458944
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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3. 
Cover image for High temperature polymer dielectrics : fundamentals and applications in power equipment
High temperature polymer dielectrics : fundamentals and applications in power equipment
Author 
Zha, Jun-Wei, editor Dang, Zhi-Min, editor
Preferred Shelf Number 
QC585 .H54 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841059
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4. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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5. 
Cover image for Design of power management integrated circuits
Design of power management integrated circuits
Author 
Wicht, B. (Bernhard), 1970- author.
Preferred Shelf Number 
TK7874 .W53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119123095
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6. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2140-5
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7. 
Cover image for Design of electromechanical products : an agile and systems approach
Design of electromechanical products : an agile and systems approach
Author 
Jamnia, Ali, 1961- author.
Preferred Shelf Number 
TK2331
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003301523
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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8. 
Cover image for Progress in Sustainable Manufacturing
Progress in Sustainable Manufacturing
Author 
Kandasamy, Jayakrishna. editor. Sakthivel, Aravind Raj. editor. Davim, J. Paulo. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0201-9
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9. 
Cover image for Handbook of Neuroengineering
Handbook of Neuroengineering
Author 
Thakor, Nitish V. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-16-5540-1
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10. 
Cover image for Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Novel & Intelligent Digital Systems: Proceedings of the 3rd International Conference (NiDS 2023) Volume 2
Author 
Kabassi, Katerina. editor. Mylonas, Phivos. editor. Caro, Jaime. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-44146-2
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11. 
Cover image for Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Proceedings of 2nd International Conference on Artificial Intelligence, Robotics, and Communication ICAIRC 2022
Author 
Yadav, Sanjay. editor. Kumar, Harish. editor. Kankar, Pavan Kumar. editor. Dai, Wanyang. editor. Huang, Fenghua. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-4554-2
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12. 
Cover image for Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Industry 4.0: The Power of Data Selected Papers from the 15th International Conference on Industrial Engineering and Industrial Management
Author 
Izquierdo, Luis R. editor. Santos, José Ignacio. editor. Lavios, Juan José. editor. Ahedo, Virginia. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29382-5
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