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25. 
Cover image for Fundamentals of Electromigration-Aware Integrated Circuit Design
Fundamentals of Electromigration-Aware Integrated Circuit Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Rothe, Susann. author. Thiele, Matthias. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-80023-8
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26. 
Cover image for Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Proceedings of the 2023 International Conference on Wireless Communications, Networking and Applications
Author 
Siarry, Patrick. editor. (orcid)0000-0002-5722-4115 Jabbar, M. A. editor. Cheung, Simon King Sing. editor. (orcid)0000-0002-7323-0961 Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-2409-6
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27. 
Cover image for SOC-Based Solutions in Emerging Application Domains
SOC-Based Solutions in Emerging Application Domains
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Chakravarthi, Veena S. author. (orcid)0000-0002-8703-2376 Koteshwar, Shivananda R. author. (orcid)0000-0003-4299-4069 SpringerLink (Online service)
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28. 
Cover image for Fully-Integrated Low-Dropout Regulators
Fully-Integrated Low-Dropout Regulators
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Mao, Xiangyu. author. (orcid)0000-0001-6530-8311 Lu, Yan. author. Martins, Rui P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-84916-9
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29. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4675-3
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30. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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31. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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32. 
Cover image for Advanced Techniques for Assertion-Based Verification in Hardware Designs Using Data Mining Algorithms
Advanced Techniques for Assertion-Based Verification in Hardware Designs Using Data Mining Algorithms
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Heidari Iman, Mohammad Reza. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-90410-3
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33. 
Cover image for Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
Piezoelectric Bending Transducers The Physics of Their Static and Dynamic Behaviour A Textbook About Indispensable Actuators in Microtechnology, Mechatronics and Medical Technology
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Ballas, Rüdiger G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-70689-3
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34. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
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Wang, Kaiying. author. SpringerLink (Online service)
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35. 
Cover image for Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Author 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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36. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
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Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-9231-6
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