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25. 
Cover image for Solder Joint Technology Materials, Properties, and Reliability
Solder Joint Technology Materials, Properties, and Reliability
Author 
Tu, King-Ning. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-38892-2
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26. 
Cover image for Lead-Free Soldering
Lead-Free Soldering
Author 
Bath, Jasbir. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-387-68422-2
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27. 
Cover image for A Guide to Lead-free Solders Physical Metallurgy and Reliability
A Guide to Lead-free Solders Physical Metallurgy and Reliability
Author 
Evans, John W. author. Engelmaier, Werner. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84628-310-9
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28. 
Cover image for Bonding in Microsystem Technology
Bonding in Microsystem Technology
Author 
Dziuban, Jan A. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/1-4020-4589-1
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29. 
Cover image for Handbook of Advanced Magnetic Materials
Handbook of Advanced Magnetic Materials
Author 
Liu, Yi. editor. Sellmyer, David J. editor. Shindo, Daisuke. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b115335
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30. 
Cover image for Nanotechnology Assessment and Perspectives
Nanotechnology Assessment and Perspectives
Author 
Brune, H. author. Ernst, H. author. Grunwald, A. author. Grünwald, W. author. Hofmann, H. author.
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http://dx.doi.org/10.1007/3-540-32820-3
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31. 
Cover image for Advanced Magnetic Nanostructures
Advanced Magnetic Nanostructures
Author 
Sellmyer, David. editor. Skomski, Ralph. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101199
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32. 
Cover image for Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Ferroelectric Thin Films Basic Properties and Device Physics for Memory Applications
Author 
Okuyama, Masanori. editor. Ishibashi, Yoshihiro. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b99517
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33. 
Cover image for Nanotribology and Nanomechanics An Introduction
Nanotribology and Nanomechanics An Introduction
Author 
Bhushan, Bharat. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-28248-3
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34. 
Cover image for Materials for Information Technology Devices, Interconnects and Packaging
Materials for Information Technology Devices, Interconnects and Packaging
Author 
Zschech, Ehrenfried. editor. Whelan, Caroline. editor. Mikolajick, Thomas. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-84628-235-7
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