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1. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-43199-4
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2. 
Cover image for Nanoporous Metals for Advanced Energy Technologies
Nanoporous Metals for Advanced Energy Technologies
Author 
Ding, Yi. author. Zhang, Zhonghua. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29749-1
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3. 
Cover image for Elements of Plasma Technology
Elements of Plasma Technology
Author 
Wong, Chiow San. author. Mongkolnavin, Rattachat. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0117-8
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4. 
Cover image for Handbook of Visual Display Technology
Handbook of Visual Display Technology
Author 
Chen, Janglin. editor. Cranton, Wayne. editor. Fihn, Mark. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-14346-0
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5. 
Cover image for Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Ferromagnetic Microwire Composites From Sensors to Microwave Applications
Author 
Peng, Hua-Xin. author. Qin, Faxiang. author. Phan, Manh-Huong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-29276-2
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6. 
Cover image for Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Numerical Simulation of Mechatronic Sensors and Actuators Finite Elements for Computational Multiphysics
Author 
Kaltenbacher, Manfred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-40170-1
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7. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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8. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9266-5
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9. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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10. 
Cover image for The Liquid Crystal Display Story 50 Years of Liquid Crystal R&D that lead The Way to the Future
The Liquid Crystal Display Story 50 Years of Liquid Crystal R&D that lead The Way to the Future
Author 
Koide, Naoyuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54859-1
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11. 
Cover image for Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Silicon Carbide Nanostructures Fabrication, Structure, and Properties
Author 
Fan, Jiyang. author. Chu, Paul K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08726-9
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12. 
Cover image for Nanowire Field Effect Transistors: Principles and Applications
Nanowire Field Effect Transistors: Principles and Applications
Author 
Kim, Dae Mann. editor. Jeong, Yoon-Ha. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8124-9
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