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25. 
Cover image for Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Response Feature Technology for High-Frequency Electronics. Optimization, Modeling, and Design Automation
Author 
Pietrenko-Dabrowska, Anna. author. Koziel, Slawomir. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-43845-5
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26. 
Cover image for CdTe and CdZnTe Materials Material Properties and Applications
CdTe and CdZnTe Materials Material Properties and Applications
Author 
Iniewski, Kris. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-64521-1
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27. 
Cover image for Microwave Technology Field Simulation, Non-linear Circuit Technology, Components and Subsystems, Plasma Technology, Antennas and Propagation
Microwave Technology Field Simulation, Non-linear Circuit Technology, Components and Subsystems, Plasma Technology, Antennas and Propagation
Author 
Heuermann, Holger. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-45686-3
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28. 
Cover image for Emerging Radiation Detection Technology and Applications
Emerging Radiation Detection Technology and Applications
Author 
Iniewski, Kris. editor. Gadey, Harish. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-63897-8
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29. 
Cover image for Integrated Data and Energy Transfer in Wireless Networks
Integrated Data and Energy Transfer in Wireless Networks
Author 
Hu, Jie. author. Yang, Kun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-60514-7
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30. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3951-0
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31. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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32. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Author 
Manetakis, Konstantinos. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31086-7
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33. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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34. 
Cover image for Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Planar Spiral Inductors, Planar Antennas and Embedded Planar Transformers SPICE-based Design and Performance Evaluation for Wireless Communications
Author 
Banerjee, Amal. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-08778-3
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35. 
Cover image for Essential Circuit Analysis Using Proteus®
Essential Circuit Analysis Using Proteus®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-4353-9
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36. 
Cover image for Sensor networks in theory and practice Successfully realize embedded systems projects
Sensor networks in theory and practice Successfully realize embedded systems projects
Author 
Meroth, Ansgar. author. Sora, Petre. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-39576-6
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