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25. 
Cover image for Error Control for Network-on-Chip Links
Error Control for Network-on-Chip Links
Author 
Fu, Bo. author. Ampadu, Paul. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9313-7
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26. 
Cover image for Multiprocessor Systems on Chip Design Space Exploration
Multiprocessor Systems on Chip Design Space Exploration
Author 
Kempf, Torsten. author. Ascheid, Gerd. author. Leupers, Rainer. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8153-0
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27. 
Cover image for CMOS High Efficiency On-chip Power Management
CMOS High Efficiency On-chip Power Management
Author 
Hu, John. author. Ismail, Mohammed. author. SpringerLink (Online service)
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ONLINE
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http://dx.doi.org/10.1007/978-1-4419-9526-1
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28. 
Cover image for Architectures for computer vision : from algorithm to chip with Verilog
Architectures for computer vision : from algorithm to chip with Verilog
Author 
Jeong, Hong, author.
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ONLINE(341656.1)
Electronic Access 
ebrary An electronic book accessible through the World Wide Web; click to view
John Wiley http://dx.doi.org/10.1002/9781118659199
Safari Books Online http://proquest.safaribooksonline.com/?fpi=9781118659236
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29. 
Cover image for Health Information Processing 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings, Part I
Health Information Processing 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings, Part I
Author 
Zhang, Yanchun. editor. Chen, Qingcai. editor. (orcid)0000-0001-8473-7293 Lin, Hongfei. editor. (orcid)0000-0003-0872-7688 Liu, Lei. editor. Liao, Xiangwen. editor.
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https://doi.org/10.1007/978-981-96-3755-3
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30. 
Cover image for Health Information Processing. Evaluation Track Papers 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings
Health Information Processing. Evaluation Track Papers 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings
Author 
Zhang, Yanchun. editor. Chen, Qingcai. editor. (orcid)0000-0001-8473-7293 Lin, Hongfei. editor. (orcid)0000-0003-0872-7688 Liu, Lei. editor. Liao, Xiangwen. editor.
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https://doi.org/10.1007/978-981-96-4298-4
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31. 
Cover image for Health Information Processing 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings, Part II
Health Information Processing 10th China Health Information Processing Conference, CHIP 2024, Fuzhou, China, November 15-17, 2024, Proceedings, Part II
Author 
Zhang, Yanchun. editor. Chen, Qingcai. editor. (orcid)0000-0001-8473-7293 Lin, Hongfei. editor. (orcid)0000-0003-0872-7688 Liu, Lei. editor. Liao, Xiangwen. editor.
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https://doi.org/10.1007/978-981-96-3752-2
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32. 
Cover image for Making a semiconductor superpower : the seven engineers from KAIST who shaped the chip industry
Making a semiconductor superpower : the seven engineers from KAIST who shaped the chip industry
Author 
Kim, Dong-Won, 1960- author.
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HD9696 .S43
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003353911
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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33. 
Cover image for Advancements in AI and IoT for chip manufacturing and defect prevention
Advancements in AI and IoT for chip manufacturing and defect prevention
Author 
Jain, Rupal, author.
Preferred Shelf Number 
TK7871.85
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9788770046824
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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34. 
Cover image for Intelligence in chip : integrated sensors and memristive computing
Intelligence in chip : integrated sensors and memristive computing
Author 
James, Alex, editor. Ascoli, Alon, editor. Choubey, Bhaskar, editor.
Preferred Shelf Number 
TK7874
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Taylor & Francis https://www.taylorfrancis.com/books/9788770042536
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35. 
Cover image for Chip-Scale Power Supplies for DC-Link and Grid Applications
Chip-Scale Power Supplies for DC-Link and Grid Applications
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Rindfleisch, Christoph. author. (orcid)0000-0002-2122-5917 Wicht, Bernhard. author. (orcid)0000-0003-0066-2955 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-60820-9
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36. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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