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25. 
Cover image for Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Languages, Design Methods, and Tools for Electronic System Design Selected Contributions from FDL 2013
Author 
Louërat, Marie-Minerve. editor. Maehne, Torsten. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-06317-1
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26. 
Cover image for Reliable Design of Electronic Equipment An Engineering Guide
Reliable Design of Electronic Equipment An Engineering Guide
Author 
Natarajan, Dhanasekharan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09111-2
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27. 
Cover image for Electronic Beam Steering and Polarization Agile Planar Antennas in Liquid Crystal Technology
Electronic Beam Steering and Polarization Agile Planar Antennas in Liquid Crystal Technology
Author 
Karabey, Onur Hamza. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01424-1
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28. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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29. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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30. 
Cover image for Wide Bandgap Semiconductors Fundamental Properties and Modern Photonic and Electronic Devices
Wide Bandgap Semiconductors Fundamental Properties and Modern Photonic and Electronic Devices
Author 
Takahashi, Kiyoshi. editor. Yoshikawa, Akihiko. editor. Sandhu, Adarsh. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-47235-3
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31. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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32. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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33. 
Cover image for Electronic Noise and Interfering Signals Principles and Applications
Electronic Noise and Interfering Signals Principles and Applications
Author 
Vasilescu, Gabriel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137720
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34. 
Cover image for Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Ultrathin Magnetic Structures I An Introduction to the Electronic, Magnetic and Structural Properties
Author 
Bland, J. Anthony C. Heinrich, Bretislav. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138789
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35. 
Cover image for Timing Performance of Nanometer Digital Circuits Under Process Variations
Timing Performance of Nanometer Digital Circuits Under Process Variations
Author 
Champac, Victor. author. Garcia Gervacio, Jose. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-75465-9
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36. 
Cover image for Flexible Electronics Materials and Applications
Flexible Electronics Materials and Applications
Author 
Salleo, Alberto. editor. Wong, William S. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-74363-9
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