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1. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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2. 
Cover image for Fast circuit boards : energy management
Fast circuit boards : energy management
Author 
Morrison, Ralph, author.
Preferred Shelf Number 
TK7874.7 .M67 2018
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119413950
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3. 
Cover image for Scientific wet process technology for innovative LSI/FPD manufacturing
Scientific wet process technology for innovative LSI/FPD manufacturing
Author 
Ōmi, Tadahiro, 1939-2016, editor.
Preferred Shelf Number 
TK7871.85
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781315221076
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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4. 
Cover image for Three-dimensional integrated circuit design
Three-dimensional integrated circuit design
Author 
Pavlidis, Vasilis F., 1976- author. Savidis, Ioannis, author. Frian, Eby G., author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780124105010
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5. 
Cover image for SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
SiP-system in package design and simulation : Mentor EE Flow Advanced Design Guide
Author 
Li, Suny, 1974- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119045991
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6. 
Cover image for Analog circuit design. Volume 3, Design note collection
Analog circuit design. Volume 3, Design note collection
Author 
Dobkin, Bob, author. Hamburger, John, author.
Preferred Shelf Number 
ONLINE(355556.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780128000014
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7. 
Cover image for High speed digital design : design of high speed interconnects and signaling
High speed digital design : design of high speed interconnects and signaling
Author 
Zhang, Hanqiao, author. Krooswyk, Steven, author. Ou, Jeffrey, author.
Preferred Shelf Number 
ONLINE(364056.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780124186637
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8. 
Cover image for Top-down digital VLSI design from architectures to gate-level circuits and FPGAs
Top-down digital VLSI design from architectures to gate-level circuits and FPGAs
Author 
Kaeslin, Hubert, author.
Preferred Shelf Number 
ONLINE(355481.1)
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780128007303
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9. 
Cover image for ESD : analog circuits and design
ESD : analog circuits and design
Author 
Voldman, Steven H.
Preferred Shelf Number 
ONLINE(341679.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9781118701409
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10. 
Cover image for Handbook of 3D Integration : 3D process technology
Handbook of 3D Integration : 3D process technology
Author 
Garrou, Philip E., editor. Koyanagi, Mitsumasa, editor. Ramm, Peter, editor.
Preferred Shelf Number 
ONLINE(342210.1)
Electronic Access 
John Wiley http://dx.doi.org/10.1002/9783527670109
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11. 
Cover image for Circuit design : techniques for non-crystalline semiconductors
Circuit design : techniques for non-crystalline semiconductors
Author 
Sambandan, Sanjiv., author.
Preferred Shelf Number 
TK7871.99 .A45 S26 2013
Electronic Access 
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12. 
Cover image for Analog circuit design. Volume 2, Immersion in the black art of analog design
Analog circuit design. Volume 2, Immersion in the black art of analog design
Author 
Dobkin, Bob. Williams, Jim.
Preferred Shelf Number 
ONLINE
Electronic Access 
Knovel http://app.knovel.com/web/toc.v/cid:kpACDIBAA3/viewerType:toc/
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