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25. 
Cover image for Model Tests and Numerical Simulations of Liquefaction and Lateral Spreading II LEAP-ASIA-2019
Model Tests and Numerical Simulations of Liquefaction and Lateral Spreading II LEAP-ASIA-2019
Author 
Tobita, Tetsuo. editor. (orcid)0000-0002-1765-2721 Ichii, Koji. editor. Ueda, Kyohei. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-48821-4
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26. 
Cover image for Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 2: Materials Applications, Machining, and Renewable Energy
Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 2: Materials Applications, Machining, and Renewable Energy
Author 
Long, Banh Tien. editor. Ishizaki, Kozo. editor. Kim, Hyung Sun. editor. (orcid)0000-0003-1499-8484 Kim, Yun-Hae. editor. Toan, Nguyen Duc. editor. (orcid)0000-0001-9619-4476
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https://doi.org/10.1007/978-3-031-39090-6
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27. 
Cover image for Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 3: Sustainable Approaches in Machine Design, Life Cycle Engineering, and Energy Management for Manufacturing Processes
Proceedings of the 3rd Annual International Conference on Material, Machines and Methods for Sustainable Development (MMMS2022) Volume 3: Sustainable Approaches in Machine Design, Life Cycle Engineering, and Energy Management for Manufacturing Processes
Author 
Long, Banh Tien. editor. Ishizaki, Kozo. editor. Kim, Hyung Sun. editor. (orcid)0000-0003-1499-8484 Kim, Yun-Hae. editor. Toan, Nguyen Duc. editor. (orcid)0000-0001-9619-4476
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Electronic Access 
https://doi.org/10.1007/978-3-031-57460-3
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28. 
Cover image for Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Advances in Microelectronics, Embedded Systems and IoT Proceedings of 8th International Conference on Microelectronics, Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Chakravarthy, V. V. S. S. S. editor. Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Anguera, Jaume. editor. Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893
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https://doi.org/10.1007/978-981-97-0767-6
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29. 
Cover image for Polysaccharide Based Films for Food Packaging: Fundamentals, Properties and Applications
Polysaccharide Based Films for Food Packaging: Fundamentals, Properties and Applications
Author 
Amin, Tawheed. editor. (orcid)0000-0003-2919-7065 Naik, H. R. editor. Hussain, Syed Zameer. editor. (orcid)0000-0002-8542-7673 Wani, Sajad Mohd. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-4898-7
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30. 
Cover image for Pavement, Roadway, and Bridge Life Cycle Assessment 2024 ISPRB LCA
Pavement, Roadway, and Bridge Life Cycle Assessment 2024 ISPRB LCA
Author 
Flintsch, Gerardo W. editor. Amarh, Eugene A. editor. Harvey, John. editor. Al-Qadi, Imad L. editor. Ozer, Hasan. editor.
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Electronic Access 
https://doi.org/10.1007/978-3-031-61585-6
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31. 
Cover image for Nano-formulation of Dietary Phytochemicals for Cancer Management
Nano-formulation of Dietary Phytochemicals for Cancer Management
Author 
Puranik, Nidhi. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-8005-1
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32. 
Cover image for Silicon Advances for Sustainable Agriculture and Human Health Increased Nutrition and Disease Prevention
Silicon Advances for Sustainable Agriculture and Human Health Increased Nutrition and Disease Prevention
Author 
de Mello Prado, Renato. editor. (orcid)0000-0003-1998-6343 Etesami, Hassan. editor. (orcid)0000-0002-5225-7209 Srivastava, Anoop Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-69876-7
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33. 
Cover image for Technology innovation for the circular economy : recycling, remanufacturing, design, system analysis and logistics
Technology innovation for the circular economy : recycling, remanufacturing, design, system analysis and logistics
Author 
Nasr, Nabil (Engineering professor), editor.
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HC79 .E5
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214297
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34. 
Cover image for Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Evolution in Signal Processing and Telecommunication Networks Proceedings of 8th International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2023)
Author 
Bhateja, Vikrant. editor. (orcid)0000-0002-3259-8874 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 Flores-Fuentes, Wendy. editor. (orcid)0000-0002-1477-7449 Urooj, Shabana. editor. (orcid)0000-0002-1477-8759 Sankar Dhar, Rudra. editor. (orcid)0000-0002-6571-3808
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https://doi.org/10.1007/978-981-97-0644-0
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35. 
Cover image for Component Surfaces Manufacturing-Morphology-Property Relationships
Component Surfaces Manufacturing-Morphology-Property Relationships
Author 
Aurich, Jan C. editor. (orcid)0000-0001-7063-9334 Hasse, Hans. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35575-2
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36. 
Cover image for HCI International 2023 - Late Breaking Posters 25th International Conference on Human-Computer Interaction, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
HCI International 2023 - Late Breaking Posters 25th International Conference on Human-Computer Interaction, HCII 2023, Copenhagen, Denmark, July 23-28, 2023, Proceedings, Part I
Author 
Stephanidis, Constantine. editor. Antona, Margherita. editor. Ntoa, Stavroula. editor. (orcid)0000-0002-6270-8333 Salvendy, Gavriel. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-49212-9
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