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1. 
Cover image for Detection and Signal Processing Technical Realization
Detection and Signal Processing Technical Realization
Author 
Witteman, Wilhelmus Jacobus. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-540-29600-3
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2. 
Cover image for Microcontrollers in Practice
Microcontrollers in Practice
Author 
Mitescu, Marian. author. Susnea, Ioan. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/3-540-28308-0
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3. 
Cover image for System-level Test and Validation of Hardware/Software Systems
System-level Test and Validation of Hardware/Software Systems
Author 
Sonza Reorda, Matteo. editor. Peng, Zebo. editor. Violante, Massimo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/1-84628-145-8
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4. 
Cover image for Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Author 
Arif, Tariq M., author. John Wiley & Sons, publisher.
Preferred Shelf Number 
Q325.73 .A75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394269297
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5. 
Cover image for Nanonetworks : the future of communication and computation
Nanonetworks : the future of communication and computation
Author 
Lau, Florian-Lennert A., author.
Preferred Shelf Number 
TK7874.845 .L38 2024
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394213139
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6. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-04954-5
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7. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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8. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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9. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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10. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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11. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
Author 
Collinson, R.P.G. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-29215-6
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12. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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