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1. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-12862-7
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2. 
Cover image for Arbitrary Modeling of TSVs for 3D Integrated Circuits
Arbitrary Modeling of TSVs for 3D Integrated Circuits
Author 
Salah, Khaled. author. Ismail, Yehea. author. El-Rouby, Alaa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-07611-9
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3. 
Cover image for Source-Synchronous Networks-On-Chip Circuit and Architectural Interconnect Modeling
Source-Synchronous Networks-On-Chip Circuit and Architectural Interconnect Modeling
Author 
Mandal, Ayan. author. Khatri, Sunil P. author. Mahapatra, Rabi. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9405-8
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4. 
Cover image for Noise-Shaping All-Digital Phase-Locked Loops Modeling, Simulation, Analysis and Design
Noise-Shaping All-Digital Phase-Locked Loops Modeling, Simulation, Analysis and Design
Author 
Brandonisio, Francesco. author. Kennedy, Michael Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-03659-5
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5. 
Cover image for Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Soft Actuators Materials, Modeling, Applications, and Future Perspectives
Author 
Asaka, Kinji. editor. Okuzaki, Hidenori. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54767-9
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6. 
Cover image for System-Level Validation High-Level Modeling and Directed Test Generation Techniques
System-Level Validation High-Level Modeling and Directed Test Generation Techniques
Author 
Chen, Mingsong. author. Qin, Xiaoke. author. Koo, Heon-Mo. author. Mishra, Prabhat. author. SpringerLink (Online service)
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ONLINE(331265.1)
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http://dx.doi.org/10.1007/978-1-4614-1359-2
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7. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J. W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-319-00122-7
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8. 
Cover image for Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Limits, Modeling and Design of High-Speed Permanent Magnet Machines
Author 
Borisavljevic, Aleksandar. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-33457-3
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9. 
Cover image for Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Power Electronic Packaging Design, Assembly Process, Reliability and Modeling
Author 
Liu, Yong. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1053-9
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10. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
Author 
McPherson, J.W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6348-2
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11. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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12. 
Cover image for High-Level Modeling and Synthesis of Analog Integrated Systems
High-Level Modeling and Synthesis of Analog Integrated Systems
Author 
Martens, Ewout S. J. author. Gielen, Georges G. E. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-6802-7
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