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25. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-7759-5
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26. 
Cover image for Nano-Electronic Devices Semiclassical and Quantum Transport Modeling
Nano-Electronic Devices Semiclassical and Quantum Transport Modeling
Author 
Vasileska, Dragica. editor. Goodnick, Stephen M. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-8840-9
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27. 
Cover image for Simulation and Verification of Electronic and Biological Systems
Simulation and Verification of Electronic and Biological Systems
Author 
Li, Peng. editor. Silveira, Luís Miguel. editor. Feldmann, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-0149-6
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28. 
Cover image for ISSE 2010 Securing Electronic Business Processes Highlights of the Information Security Solutions Europe 2010 Conference
ISSE 2010 Securing Electronic Business Processes Highlights of the Information Security Solutions Europe 2010 Conference
Author 
Pohlmann, Norbert. editor. Reimer, Helmut. editor. Schneider, Wolfgang. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-8348-9788-6
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29. 
Cover image for Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Lock-in Thermography Basics and Use for Evaluating Electronic Devices and Materials
Author 
Breitenstein, Otwin. author. Warta, Wilhelm. author. Langenkamp, Martin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-02417-7
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30. 
Cover image for ESL Models and their Application Electronic System Level Design and Verification in Practice
ESL Models and their Application Electronic System Level Design and Verification in Practice
Author 
Bailey, Brian. author. Martin, Grant. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-0965-7
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31. 
Cover image for Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Lead-Free Electronic Solders A Special Issue of the Journal of Materials Science: Materials in Electronics
Author 
Subramanian, K. N. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-387-48433-4
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32. 
Cover image for Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Physics of Negative Refraction and Negative Index Materials Optical and Electronic Aspects and Diversified Approaches
Author 
Krowne, Clifford M. editor. Zhang, Yong. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-72132-1
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33. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Author 
Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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34. 
Cover image for Platform Based Design at the Electronic System Level Industry Perspectives and Experiences
Platform Based Design at the Electronic System Level Industry Perspectives and Experiences
Author 
Burton, Mark. author. Morawiec, Adam. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-5138-7
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35. 
Cover image for Dynamic and Robust Streaming in and between Connected Consumer-Electronic Devices
Dynamic and Robust Streaming in and between Connected Consumer-Electronic Devices
Author 
Stok, Peter. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-3454-7
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36. 
Cover image for Electronic Noise and Interfering Signals Principles and Applications
Electronic Noise and Interfering Signals Principles and Applications
Author 
Vasilescu, Gabriel. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b137720
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