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1. 
Cover image for Nanostructured Nonlinear Optical Materials : Formation and Characterization
Nanostructured Nonlinear Optical Materials : Formation and Characterization
Author 
Ganeev, Rashid A., author.
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ScienceDirect https://www.sciencedirect.com/science/book/9780128143032
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Cover image for Fan-Out Wafer-Level Packaging
Fan-Out Wafer-Level Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-8884-1
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Cover image for Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Synthesis and Characterization of Piezotronic Materials for Application in Strain/Stress Sensing
Author 
Zhu, Ren. author. Yang, Rusen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-70038-0
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4. 
Cover image for Cadmium based II-VI Semiconducting Nanomaterials Synthesis Routes and Strategies
Cadmium based II-VI Semiconducting Nanomaterials Synthesis Routes and Strategies
Author 
Majid, Abdul. author. Bibi, Maryam. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-68753-7
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5. 
Cover image for Selected Topics in Photonics
Selected Topics in Photonics
Author 
Pradhan, Asima. editor. Krishnamurthy, Pradeep Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-5010-7
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6. 
Cover image for EM Material Characterization Techniques for Metamaterials
EM Material Characterization Techniques for Metamaterials
Author 
Nair, Raveendranath U. author. Dutta, Maumita. author. P.S., Mohammed Yazeen. author. Venu, K. S. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-6517-0
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7. 
Cover image for Optical and Wireless Technologies Proceedings of OWT 2017
Optical and Wireless Technologies Proceedings of OWT 2017
Author 
Janyani, Vijay. editor. Tiwari, Manish. editor. Singh, Ghanshyam. editor. Minzioni, Paolo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-7395-3
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8. 
Cover image for Solid State Lighting Reliability Part 2 Components to Systems
Solid State Lighting Reliability Part 2 Components to Systems
Author 
van Driel, Willem Dirk. editor. Fan, Xuejun. editor. Zhang, Guo Qi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-58175-0
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9. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
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Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-45098-8
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10. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-43199-4
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11. 
Cover image for Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Modern Aspects of Josephson Dynamics and Superconductivity Electronics
Author 
Askerzade, Iman. author. Bozbey, Ali. author. Cantürk, Mehmet. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-48433-4
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12. 
Cover image for Fundamentals of Electroheat Electrical Technologies for Process Heating
Fundamentals of Electroheat Electrical Technologies for Process Heating
Author 
Lupi, Sergio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-46015-4
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