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25. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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26. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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27. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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28. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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29. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Author 
Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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30. 
Cover image for Design of Switched-Capacitor Filter Circuits using Low Gain Amplifiers
Design of Switched-Capacitor Filter Circuits using Low Gain Amplifiers
Author 
Serra, Hugo Alexandre de Andrade. author. Paulino, Nuno. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-11791-1
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31. 
Cover image for FPGA Design Best Practices for Team-based Reuse
FPGA Design Best Practices for Team-based Reuse
Author 
Simpson, Philip Andrew. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-17924-7
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32. 
Cover image for Engineering Embedded Systems Physics, Programs, Circuits
Engineering Embedded Systems Physics, Programs, Circuits
Author 
Hintenaus, Peter. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10680-9
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33. 
Cover image for Multiprocessor Scheduling for Real-Time Systems
Multiprocessor Scheduling for Real-Time Systems
Author 
Baruah, Sanjoy. author. Bertogna, Marko. author. Buttazzo, Giorgio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08696-5
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34. 
Cover image for Hot Carrier Degradation in Semiconductor Devices
Hot Carrier Degradation in Semiconductor Devices
Author 
Grasser, Tibor. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-08994-2
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35. 
Cover image for Introduction to Microsystem Design
Introduction to Microsystem Design
Author 
Schomburg, Werner Karl. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47023-7
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36. 
Cover image for Embedded Systems Design for High-Speed Data Acquisition and Control
Embedded Systems Design for High-Speed Data Acquisition and Control
Author 
Di Paolo Emilio, Maurizio. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06865-7
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