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1. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-14186-7
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2. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-19-2308-1
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3. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-0451-8
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4. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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5. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-9917-8
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6. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-0357-3
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7. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-99-1455-5
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8. 
Cover image for Graphene field-effect transistors : advanced bioelectronic devices for sensing applications
Graphene field-effect transistors : advanced bioelectronic devices for sensing applications
Author 
Azzaroni, Omar, editor. Knoll, Wolfgang, editor.
Preferred Shelf Number 
TK7871.95 .G73 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843374
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9. 
Cover image for Analog devices and circuits. 1, Analog devices
Analog devices and circuits. 1, Analog devices
Author 
Gontrand, Christian, author.
Preferred Shelf Number 
TK7867 .G66 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394255474
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10. 
Cover image for 75th anniversary of the transistor
75th anniversary of the transistor
Author 
Nathan, Arokia, 1957- editor. Saha, Samar K., editor. Todi, Ravi M., editor.
Preferred Shelf Number 
TK7871.9
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394202478
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11. 
Cover image for LIQUID CRYSTAL DISPLAYS : addressing schemes and electro-optical effects.
LIQUID CRYSTAL DISPLAYS : addressing schemes and electro-optical effects.
Author 
LUEDER, ERNST. KNOLL, PETER. LEE, SANG-HEE.
Preferred Shelf Number 
TK7872 .L56
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119667940
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12. 
Cover image for Electronics : from classical to quantum
Electronics : from classical to quantum
Author 
Kolawole, Michael O., author.
Preferred Shelf Number 
TK7815
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003052913
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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