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1. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VII
Author 
Sha, Aimin. editor. Liu, Zhigang. editor. Wang, Xiaojun. editor. Xiao, Qian. editor. Zang, Yiming. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-1864-4
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2. 
Cover image for Circuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes
Circuit-Technology Co-Optimization of SRAM Design in Advanced CMOS Nodes
Author 
Liu, Hsiao-Hsuan. author. Catthoor, Francky. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-031-76109-6
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3. 
Cover image for CMOS-based Portable NMR/MRI Microsystems
CMOS-based Portable NMR/MRI Microsystems
Author 
Fan, Shuhao. author. Zhou, Qi. author. (orcid)0000-0002-3949-7953 Lei, Ka-Meng. author. Martins, Rui P. author. Mak, Pui-In. author.
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https://doi.org/10.1007/978-3-031-91447-8
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4. 
Cover image for Analog devices and circuits. 2, Analog devices
Analog devices and circuits. 2, Analog devices
Author 
Gontrand, Christian, author.
Preferred Shelf Number 
TK7867 .G65 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394276769
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5. 
Cover image for Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Smart sensors for industry 4.0 : fundamentals, fabrication and IIoT applications
Author 
Mishra, Brojo Kishore, 1979- editor. Mallik, Sandipan, editor. Le, Dac-Nhuong, 1983- editor.
Preferred Shelf Number 
TK7872 .D48 S63 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394214723
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6. 
Cover image for Single Flux Quantum Integrated Circuit Design
Single Flux Quantum Integrated Circuit Design
Author 
Krylov, Gleb. author. Jabbari, Tahereh. author. Friedman, Eby G. author. (orcid)0000-0002-5549-7160 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-47475-0
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7. 
Cover image for Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-97-2140-5
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8. 
Cover image for Microwave Numerical Solutions
Microwave Numerical Solutions
Author 
Cantaragiu, Ștefan. author. (orcid)0009-0005-4760-958X SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-61209-1
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9. 
Cover image for Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Author 
Duan, Baoyan, author. Zhang, Shuxin (Professor of electromechanical engineering), author.
Preferred Shelf Number 
TK7876 .D83 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119904427
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10. 
Cover image for Graphene for post-Moore silicon optoelectronics
Graphene for post-Moore silicon optoelectronics
Author 
Xu, Yang, author.
Preferred Shelf Number 
TA1750 .X8 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527841011
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11. 
Cover image for Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Emerging Computing: From Devices to Systems Looking Beyond Moore and Von Neumann
Author 
Aly, Mohamed M. Sabry. editor. Chattopadhyay, Anupam. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-16-7487-7
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12. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-1906-0
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