Limit Search Results
Author
SpringerLink (Online service)
(125)
Razeghi, Manijeh. author.
(3)
Fan, X.J. editor.
(2)
Korkin, Anatoli. editor.
(2)
Nazarov, Alexei N. editor.
(2)
Language
Publication Date
-
Subject
Optical materials.
(125)
Engineering.
(60)
Nanotechnology.
(30)
Chemistry.
(26)
Systems engineering.
(21)
Material Type
Shelf Location
Library
Switch to list view
Switch to thumbnail view
Select an Action
125 Results Found Subscribe to search results
000000000000DEFAULT
Print
1. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(332657.1)
Electronic Access 
http://dx.doi.org/10.1007/978-3-319-00002-2
Format: 
Availability 
Online Library~1
Available:
Copies:
2. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
Format: 
Availability 
Online Library~1
Available:
Copies:
3. 
Cover image for Solid State Lighting Reliability Components to Systems
Solid State Lighting Reliability Components to Systems
Author 
van Driel, W.D. editor. Fan, X.J. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331314.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-3067-4
Format: 
Availability 
Online Library~1
Available:
Copies:
4. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0463-7
Format: 
Availability 
Online Library~1
Available:
Copies:
5. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-1812-2
Format: 
Availability 
Online Library~1
Available:
Copies:
6. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-34237-0
Format: 
Availability 
Online Library~1
Available:
Copies:
7. 
Cover image for Semiconductor Modeling Techniques
Semiconductor Modeling Techniques
Author 
Balkan, Naci. editor. Xavier, Marie. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-27512-8
Format: 
Availability 
Online Library~1
Available:
Copies:
8. 
Cover image for Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Multifunctional Polycrystalline Ferroelectric Materials Processing and Properties
Author 
Pardo, Lorena. author. Ricote, Jesús. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-90-481-2875-4
Format: 
Availability 
Online Library~1
Available:
Copies:
9. 
Cover image for Electronic Properties of Materials
Electronic Properties of Materials
Author 
Hummel, Rolf E. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-8164-6
Format: 
Availability 
Online Library~1
Available:
Copies:
10. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5760-3
Format: 
Availability 
Online Library~1
Available:
Copies:
11. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-236-0
Format: 
Availability 
Online Library~1
Available:
Copies:
12. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-0-85729-310-7
Format: 
Availability 
Online Library~1
Available:
Copies:
Select an Action