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1. 
Cover image for Reliability Physics and Engineering Time-To-Failure Modeling
Reliability Physics and Engineering Time-To-Failure Modeling
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McPherson, J.W. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6348-2
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Cover image for Handbook of Modern Sensors Physics, Designs, and Applications
Handbook of Modern Sensors Physics, Designs, and Applications
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Fraden, Jacob. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-6466-3
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Cover image for The Physics of Metrology All about Instruments: From Trundle Wheels to Atomic Clocks
The Physics of Metrology All about Instruments: From Trundle Wheels to Atomic Clocks
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Hebra, Alexius J. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-211-78381-8
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4. 
Cover image for Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Ferroelectrics in Microwave Devices, Circuits and Systems Physics, Modeling, Fabrication and Measurements
Author 
Gevorgian, Spartak. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-84882-507-9
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5. 
Cover image for Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
Functional Thin Films and Nanostructures for Sensors Synthesis, Physics and Applications
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Fortin, Jeffrey. editor. Zribi, Anis. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138612
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6. 
Cover image for Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
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Suhir, E. editor. Lee, Y. C. editor. Wong, C. P. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/0-387-32989-7
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7. 
Cover image for The Physics of Semiconductors An Introduction Including Devices and Nanophysics
The Physics of Semiconductors An Introduction Including Devices and Nanophysics
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Grundmann, Marius. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-34661-9
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8. 
Cover image for Carbon The Future Material for Advanced Technology Applications
Carbon The Future Material for Advanced Technology Applications
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Messina, Giacomo. editor. Santangelo, Saveria. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b105262
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9. 
Cover image for Introducing Molecular Electronics
Introducing Molecular Electronics
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Cuniberti, Gianaurelio. editor. Richter, Klaus. editor. Fagas, Giorgos. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b101525
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10. 
Cover image for Time Domain Methods in Electrodynamics
Time Domain Methods in Electrodynamics
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Russer, Peter. editor. Siart, Uwe. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-540-68768-9
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11. 
Cover image for Microscopy of Semiconducting Materials 2007
Microscopy of Semiconducting Materials 2007
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Cullis, A. G. editor. Midgley, P. A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-8615-1
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12. 
Cover image for Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
Microscopy of Semiconducting Materials Proceedings of the 14th Conference, April 11–14, 2005, Oxford, UK
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Cullis, A. G. editor. Hutchison, J. L. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/3-540-31915-8
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