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25. 
Cover image for Sensor networks in theory and practice Successfully realize embedded systems projects
Sensor networks in theory and practice Successfully realize embedded systems projects
Author 
Meroth, Ansgar. author. Sora, Petre. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-658-39576-6
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26. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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27. 
Cover image for Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Mm-wave Circuit Design in 16nm FinFET for 6G Applications
Author 
Philippe, Bart. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-11224-9
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28. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
Author 
Tran, Thanh T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-04954-5
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29. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3951-0
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30. 
Cover image for Analog and Mixed-Signal Circuits in Nanoscale CMOS
Analog and Mixed-Signal Circuits in Nanoscale CMOS
Author 
Paulo da Silva Martins, Rui. editor. Mak, Pui-In. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22231-3
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31. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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32. 
Cover image for Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Topics in LC Oscillators Principles, Phase Noise, Pulling, Inductor Design
Author 
Manetakis, Konstantinos. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-31086-7
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33. 
Cover image for Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Microelectronics, Circuits and Systems Select Proceedings of Micro2021
Author 
Biswas, Abhijit. editor. Islam, Aminul. editor. Chaujar, Rishu. editor. Jaksic, Olga. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0412-9
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34. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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35. 
Cover image for APPLICATIONS OF COMPUTATIONAL INTELLIGENCE TECHNIQUES IN COMMUNICATIONS
APPLICATIONS OF COMPUTATIONAL INTELLIGENCE TECHNIQUES IN COMMUNICATIONS
Author 
Gupta, Mridul. Verma, Pawan Kumar. Verma, Rajesh. Upadhyay, Dharmendra Kr.
Preferred Shelf Number 
TK5101
Electronic Access 
Taylor & Francis https://www.taylorfrancis.com/books/9781003452645
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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36. 
Cover image for Principles of communication engineering
Principles of communication engineering
Author 
Anand, M. L., author.
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TK5101
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Taylor & Francis https://www.taylorfrancis.com/books/9781003222279
OCLC metadata license agreement http://www.oclc.org/content/dam/oclc/forms/terms/vbrl-201703.pdf
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