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1. 
Cover image for Solid-state metal additive manufacturing : physics, processes, mechanical properties, and applications
Solid-state metal additive manufacturing : physics, processes, mechanical properties, and applications
Author 
Yu, Hang Z. editor Tuncer, Nihan, editor Feng, Zhili, editor.
Preferred Shelf Number 
TS183.25
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527839353
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Cover image for Artificial intelligence-enabled digital twin for smart manufacturing
Artificial intelligence-enabled digital twin for smart manufacturing
Author 
Tyagi, Amit Kumar, editor. Tiwari, Shrikant, editor. Arumugam, Senthil Kumar, editor. Sharma, Avinash Kumar, 1982- editor.
Preferred Shelf Number 
TS155.63 .A78 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394303601
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3. 
Cover image for Linear and nonlinear system modeling
Linear and nonlinear system modeling
Author 
Roy, Tamal, editor. Tripathi, Suman Lata, editor. Ganguli, Souvik, editor.
Preferred Shelf Number 
QA402.3 .L56 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119847533
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4. 
Cover image for Diachronic, Typological, and Areal Aspects of Converbs
Diachronic, Typological, and Areal Aspects of Converbs
Author 
Cotticelli-Kurras, Paola, editor. Dahl, Eystein, editor. Živojinović, Jelena, editor.
Preferred Shelf Number 
ONLİNE
Electronic Access 
https://www.degruyterbrill.com/isbn/9783111335551
Cover https://www.degruyterbrill.com/document/cover/isbn/9783111335551/original
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5. 
Cover image for Sustainable cities in a changing climate : enhancing urban resilience
Sustainable cities in a changing climate : enhancing urban resilience
Author 
Al-Ghamdi, Sami G, editor.
Preferred Shelf Number 
HT241 .C5955 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394201532
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6. 
Cover image for Thermal management materials for electronic packaging : preparation, characterization, and devices
Thermal management materials for electronic packaging : preparation, characterization, and devices
Author 
Tian, Xingyou, editor.
Preferred Shelf Number 
TK7870.15
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527843121
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7. 
Cover image for Design of power management integrated circuits
Design of power management integrated circuits
Author 
Wicht, B. (Bernhard), 1970- author.
Preferred Shelf Number 
TK7874 .W53 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119123095
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8. 
Cover image for Control in systems dynamics : comparative analysis of feedback strategies
Control in systems dynamics : comparative analysis of feedback strategies
Author 
Oustaloup, Alain, author.
Preferred Shelf Number 
TJ213 .O97 2024
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394332700
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9. 
Cover image for Seismic Isolation, Energy Dissipation and Active Vibration Control of Structures 17th World Conference on Seismic Isolation (17WCSI)
Seismic Isolation, Energy Dissipation and Active Vibration Control of Structures 17th World Conference on Seismic Isolation (17WCSI)
Author 
Cimellaro, Gian Paolo. editor. (orcid)0000-0001-6474-3493 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-21187-4
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10. 
Cover image for Modern Artificial Intelligence and Data Science Tools, Techniques and Systems
Modern Artificial Intelligence and Data Science Tools, Techniques and Systems
Author 
Idrissi, Abdellah. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-33309-5
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11. 
Cover image for Active Inference Third International Workshop, IWAI 2022, Grenoble, France, September 19, 2022, Revised Selected Papers
Active Inference Third International Workshop, IWAI 2022, Grenoble, France, September 19, 2022, Revised Selected Papers
Author 
Buckley, Christopher L. editor. Cialfi, Daniela. editor. Lanillos, Pablo. editor. Ramstead, Maxwell. editor. Sajid, Noor. editor.
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-28719-0
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12. 
Cover image for Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II
Advanced Hybrid Information Processing 6th EAI International Conference, ADHIP 2022, Changsha, China, September 29-30, 2022, Proceedings, Part II
Author 
Fu, Weina. editor. Yun, Lin. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-28867-8
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