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25. 
Cover image for Open circuits : the inner beauty of electronic components
Open circuits : the inner beauty of electronic components
Author 
Schlaepfe, Eric. Oskay, Windell H.
Preferred Shelf Number 
TK7870.15 S33 2023
Format: 
Availability 
Beytepe Library~1
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26. 
Cover image for Inkjet printing in industry : materials, technologies, systems, and applications
Inkjet printing in industry : materials, technologies, systems, and applications
Author 
Zapka, Werner, editor.
Preferred Shelf Number 
Z252.5 .I48 I55 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527828074
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27. 
Cover image for Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Semiconductor basics : a qualitative, non-mathematical explanation of how semiconductors work and how they are used
Author 
Domingo, George, 1937- author.
Preferred Shelf Number 
TK7871.85 .D66 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119597124
Format: 
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28. 
Cover image for Lead-free soldering process development and reliability
Lead-free soldering process development and reliability
Author 
Bath, Jasbir, editor.
Preferred Shelf Number 
TK7870.15 .L434 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119482093
Format: 
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29. 
Cover image for Harsh environment electronics : interconnect materials and performance assessment
Harsh environment electronics : interconnect materials and performance assessment
Author 
Sharif, Ahmed, editor.
Preferred Shelf Number 
TK7871
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527813964
Format: 
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30. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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31. 
Cover image for Electronic enclosures, housings and packages
Electronic enclosures, housings and packages
Author 
Süli, Frank, author.
Preferred Shelf Number 
ONLINE
Electronic Access 
ScienceDirect https://www.sciencedirect.com/science/book/9780081023914
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32. 
Cover image for Food and drink--good manufacturing practice : a guide to its responsible management
Food and drink--good manufacturing practice : a guide to its responsible management
Author 
Manning, Louise, editor.
Preferred Shelf Number 
TP369 .G7
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119388494
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33. 
Cover image for Smart electronic systems : heterogeneous integration of silicon and printed electronics
Smart electronic systems : heterogeneous integration of silicon and printed electronics
Author 
Zheng, Li-Rong, author. Tenhunen, Hannu, author. Zou, Zhuo, author.
Preferred Shelf Number 
TK7872 .P75
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527691685
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34. 
Cover image for Fundamentals of Electronic Systems Design
Fundamentals of Electronic Systems Design
Author 
Lienig, Jens. author. (orcid)0000-0002-2140-4587 Bruemmer, Hans. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-55840-0
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35. 
Cover image for RF and Microwave Microelectronics Packaging II
RF and Microwave Microelectronics Packaging II
Author 
Kuang, Ken. editor. Sturdivant, Rick. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-51697-4
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36. 
Cover image for Materials for Advanced Packaging
Materials for Advanced Packaging
Author 
Lu, Daniel. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-45098-8
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