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1. 
Cover image for MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
MEMS and Microfluidics in Healthcare Devices and Applications Perspectives
Author 
Guha, Koushik. editor. Dutta, Gorachand. editor. (orcid)0000-0003-2980-9826 Biswas, Arindam. editor. Srinivasa Rao, K. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-8714-4
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2. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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3. 
Cover image for Microsized and nanosized carriers for nonsteroidal anti-inflammatory drugs : formulation challenges and potential benefits
Microsized and nanosized carriers for nonsteroidal anti-inflammatory drugs : formulation challenges and potential benefits
Author 
Čalija, Bojan, editor.
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ScienceDirect http://www.sciencedirect.com/science/book/9780128040171
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4. 
Cover image for Nano- and microscale drug delivery systems : design and fabrication
Nano- and microscale drug delivery systems : design and fabrication
Author 
Grumezescu, Alexan Mihai, editor.
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ScienceDirect http://www.sciencedirect.com/science/book/9780323527279
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5. 
Cover image for Micro-Relay Technology for Energy-Efficient Integrated Circuits
Micro-Relay Technology for Energy-Efficient Integrated Circuits
Author 
Kam, Hei. author. Chen, Fred. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4939-2128-7
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6. 
Cover image for Frontiers of Graphene and Carbon Nanotubes Devices and Applications
Frontiers of Graphene and Carbon Nanotubes Devices and Applications
Author 
Matsumoto, Kazuhiko. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-55372-4
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7. 
Cover image for The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
The Malaysia-Japan Model on Technology Partnership International Proceedings 2013 of Malaysia-Japan Academic Scholar Conference
Author 
Ab. Hamid, Khairuddin. editor. Ono, Osamu. editor. Bostamam, Anas Muhamad. editor. Poh Ai Ling, Amy. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-4-431-54439-5
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8. 
Cover image for Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Photonic Packaging Sourcebook Fiber-Chip Coupling for Optical Components, Basic Calculations, Modules
Author 
Fischer-Hirchert, Ulrich H. P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-642-25376-8
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9. 
Cover image for Electro-Chemo-Mechanics of Anodic Porous Alumina Nano-Honeycombs: Self-Ordered Growth and Actuation
Electro-Chemo-Mechanics of Anodic Porous Alumina Nano-Honeycombs: Self-Ordered Growth and Actuation
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Cheng, Chuan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-662-47268-2
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10. 
Cover image for Buildings for Advanced Technology
Buildings for Advanced Technology
Author 
Soueid, Ahmad. editor. Teague, E. Clayton. editor. Murday, James. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-24892-9
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11. 
Cover image for Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Resonant Tunneling Quantum Waveguides of Variable Cross-Section, Asymptotics, Numerics, and Applications
Author 
Baskin, Lev. author. Neittaanmäki, Pekka. author. Plamenevskii, Boris. author. Sarafanov, Oleg. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15105-2
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12. 
Cover image for Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Intelligent Computing, Communication and Devices Proceedings of ICCD 2014, Volume 1
Author 
Jain, Lakhmi C. editor. Patnaik, Srikanta. editor. Ichalkaranje, Nikhil. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-81-322-2012-1
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