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37. 
Cover image for Essentials of C Programming with Microsoft® Visual Studio®
Essentials of C Programming with Microsoft® Visual Studio®
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35711-4
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38. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-1906-0
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39. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
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Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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40. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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41. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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42. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0408-2
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43. 
Cover image for System on Chip (SOC) Architecture A Practical Approach
System on Chip (SOC) Architecture A Practical Approach
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Chakravarthi, Veena S. author. Koteshwar, Shivananda R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36242-2
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44. 
Cover image for Integrated Electronic Payment Technologies for Smart Cities
Integrated Electronic Payment Technologies for Smart Cities
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Graham, Don. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38222-2
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45. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
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Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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46. 
Cover image for Energy Harvesting Trends for Low Power Compact Electronic Devices
Energy Harvesting Trends for Low Power Compact Electronic Devices
Author 
Nella, Anveshkumar. editor. Bhowmick, Anirban. editor. Kumar, Chandan. editor. Rajagopal, Maheswar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-35965-1
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47. 
Cover image for Technological Advancement in Instrumentation & Human Engineering Selected papers from ICMER 2021
Technological Advancement in Instrumentation & Human Engineering Selected papers from ICMER 2021
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Hassan, Mohd Hasnun Arif. editor. Zohari, Mohd Hafizi. editor. Kadirgama, Kumaran. editor. Mohamed, Nik Abdullah Nik. editor. Aziz, Amir. editor.
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https://doi.org/10.1007/978-981-19-1577-2
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48. 
Cover image for Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
Proceedings of SIE 2022 53rd Annual Meeting of the Italian Electronics Society
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Cocorullo, Giuseppe. editor. Crupi, Felice. editor. Limiti, Ernesto. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-26066-7
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