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37. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume I
A Problem-Solving Approach to Electric Circuits Volume I
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-95623-2
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38. 
Cover image for Principles of electrochemical conversion and storage devices
Principles of electrochemical conversion and storage devices
Author 
Huang, Kevin, author.
Preferred Shelf Number 
QD553 .H83 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851638
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39. 
Cover image for Composites-based perovskite solar cells
Composites-based perovskite solar cells
Author 
Hahn, Yoon-Bong, author Wang, Yousheng, author Mahmoudi, Tahmineh, author
Preferred Shelf Number 
TK2963 .P47
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527844548
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40. 
Cover image for Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Deep learning on embedded systems : a hands-on approach using Jetson Nano and Raspberry Pi
Author 
Arif, Tariq M., author. John Wiley & Sons, publisher.
Preferred Shelf Number 
Q325.73 .A75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394269297
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41. 
Cover image for Silicon Components and Processes Self Study Field-Effect Transistors
Silicon Components and Processes Self Study Field-Effect Transistors
Author 
El-Kareh, Badih. author. Hutter, Lou N. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-59193-8
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42. 
Cover image for The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
The Proceedings of the 19th Annual Conference of China Electrotechnical Society Volume VIII
Author 
Yang, Qingxin. editor. Bie, Zhaohong. editor. (orcid)0000-0003-0579-1860 Yang, Xu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4787-3
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43. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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44. 
Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
Author 
Wang, Kaiying. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-95-1606-3
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45. 
Cover image for Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Author 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7222-6
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46. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Author 
Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-96-9231-6
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47. 
Cover image for Fundamentals of VHDL for FPGA programming using Vivado
Fundamentals of VHDL for FPGA programming using Vivado
Author 
Pakdel, Majid, author.
Preferred Shelf Number 
TK7885.7
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394343126
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48. 
Cover image for A Problem-Solving Approach to Electric Circuits Volume II
A Problem-Solving Approach to Electric Circuits Volume II
Author 
Asadi, Farzin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-95634-8
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