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37. 
Cover image for Recent Advances in Metrology Select Proceedings of AdMet 2021
Recent Advances in Metrology Select Proceedings of AdMet 2021
Author 
Yadav, Sanjay. editor. Chaudhary, K.P. editor. Gahlot, Ajay. editor. Arya, Yogendra. editor. Dahiya, Aman. editor.
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Electronic Access 
https://doi.org/10.1007/978-981-19-2468-2
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38. 
Cover image for Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Microelectronics, Communication Systems, Machine Learning and Internet of Things Select Proceedings of MCMI 2020
Author 
Nath, Vijay. editor. Mandal, Jyotsna Kumar. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-1906-0
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39. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
Author 
Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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40. 
Cover image for High-Speed System and Analog Input/Output Design
High-Speed System and Analog Input/Output Design
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Tran, Thanh T. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-04954-5
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41. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3951-0
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42. 
Cover image for System on Chip (SOC) Architecture A Practical Approach
System on Chip (SOC) Architecture A Practical Approach
Author 
Chakravarthi, Veena S. author. Koteshwar, Shivananda R. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-36242-2
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43. 
Cover image for Integrated Electronic Payment Technologies for Smart Cities
Integrated Electronic Payment Technologies for Smart Cities
Author 
Graham, Don. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38222-2
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44. 
Cover image for Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Design and Implementation of Sensory Solutions for Industrial Environment Utilizing 1-wire® Technology in Industrial Solutions
Author 
Ďuďák, Juraj. author. Gašpar, Gabriel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30152-0
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45. 
Cover image for More-than-Moore Devices and Integration for Semiconductors
More-than-Moore Devices and Integration for Semiconductors
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Iacopi, Francesca. editor. Balestra, Francis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-21610-7
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46. 
Cover image for Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Proceeding of the 3rd International Conference on Electronics, Biomedical Engineering, and Health Informatics ICEBEHI 2022, 5-6 October, Surabaya, Indonesia
Author 
Triwiyanto, Triwiyanto. editor. Rizal, Achmad. editor. Caesarendra, Wahyu. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0248-4
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47. 
Cover image for Springer Handbook of Semiconductor Devices
Springer Handbook of Semiconductor Devices
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Rudan, Massimo. editor. Brunetti, Rossella. editor. Reggiani, Susanna. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-79827-7
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48. 
Cover image for Basic Electronic Circuits Problems and Solutions
Basic Electronic Circuits Problems and Solutions
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Vasudevan, K. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-09363-0
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