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1. 
Cover image for Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Author 
Lau, John. author. Fan, Xuejun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-4166-6
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Cover image for Micro-electronics and Telecommunication Engineering Proceedings of 8th ICMETE 2024
Micro-electronics and Telecommunication Engineering Proceedings of 8th ICMETE 2024
Author 
Mahapatra, Rajendra Prasad. editor. Singh, Rupali. editor. Mishra, Sukumar. editor. Gupta, Saptarshi. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-6515-0
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Cover image for Photoresist Technology in Microsystems: Principles, Processes and Applications
Photoresist Technology in Microsystems: Principles, Processes and Applications
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Wang, Kaiying. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-95-1606-3
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Cover image for Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Advances in Micro-Electronics, Embedded Systems and IoT Proceedings of Ninth International Conference on Microelectronics Electromagnetics and Telecommunications (ICMEET 2024), Volume 1
Author 
Bhateja, Vikrant. editor. Anguera, Jaume. editor. Ghosh, Anumoy. editor. (orcid)0000-0003-4865-5893 Chowdary, P. Satish Rama. editor. (orcid)0000-0002-1649-4258 SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-7222-6
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5. 
Cover image for Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Advancements in VLSI Design, Microelectronics Devices and Circuits Select Proceedings of SPIN 2025, Volume 5
Author 
Kumar, Pradeep. editor. Navaraj, William. editor. Moreira, Fernando. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-96-9231-6
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Cover image for Single element semiconductors : properties and devices
Single element semiconductors : properties and devices
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Shi, Yi (Electrical engineer), author. Yan, Shancheng, author.
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TK7871.85 .S55 2025
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https://onlinelibrary.wiley.com/doi/book/10.1002/9783527851782
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7. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
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TK7874
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https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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8. 
Cover image for Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
Embedded Machine Learning with Microcontrollers Applications on Arduino Boards
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Ünsalan, Cem. author. (orcid)0000-0002-8904-3730 Höke, Berkan. author. (orcid)0000-0001-5682-500X Atmaca, Eren. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-69421-9
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9. 
Cover image for Nanometer CMOS ICs From Basics to ASICs
Nanometer CMOS ICs From Basics to ASICs
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Veendrick, Harry. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-64249-4
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Cover image for Embedded Machine Learning with Microcontrollers Applications on STM32 Development Boards
Embedded Machine Learning with Microcontrollers Applications on STM32 Development Boards
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Ünsalan, Cem. author. (orcid)0000-0002-8904-3730 Höke, Berkan. author. (orcid)0000-0001-5682-500X Atmaca, Eren. author. SpringerLink (Online service)
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11. 
Cover image for Micro and Nanomanufacturing Volume II
Micro and Nanomanufacturing Volume II
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Jackson, Mark J. editor. (orcid)0000-0001-9087-3515 Ahmed, Waqar. editor. (orcid)0000-0003-4152-5172 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-70499-4
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12. 
Cover image for The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VIII
The Proceedings of 2024 International Conference of Electrical, Electronic and Networked Energy Systems Volume VIII
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Sha, Aimin. editor. Yang, Ming. editor. Cai, Li. editor. Hu, Changbin. editor. Li, Rui. editor.
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https://doi.org/10.1007/978-981-96-1868-2
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