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1. 
Cover image for Intelligent Manufacturing and Energy Sustainability Proceedings of ICIMES 2022
Intelligent Manufacturing and Energy Sustainability Proceedings of ICIMES 2022
Author 
Manchuri, Amaranadha Reddy. editor. Marla, Deepak. editor. Rao, V. Vasudeva. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-8497-6
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2. 
Cover image for New Trends in Disruptive Technologies, Tech Ethics and Artificial Intelligence The DITTET 2023 Collection
New Trends in Disruptive Technologies, Tech Ethics and Artificial Intelligence The DITTET 2023 Collection
Author 
de la Iglesia, Daniel H. editor. de Paz Santana, Juan F. editor. López Rivero, Alfonso J. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38344-1
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3. 
Cover image for Proceedings of Fourth Doctoral Symposium on Computational Intelligence DoSCI 2023
Proceedings of Fourth Doctoral Symposium on Computational Intelligence DoSCI 2023
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Swaroop, Abhishek. editor. Kansal, Vineet. editor. Fortino, Giancarlo. editor. Hassanien, Aboul Ella. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3716-5
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4. 
Cover image for Data Management, Analytics and Innovation Proceedings of ICDMAI 2022
Data Management, Analytics and Innovation Proceedings of ICDMAI 2022
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Goswami, Saptarsi. editor. Barara, Inderjit Singh. editor. Goje, Amol. editor. Mohan, C. editor. Bruckstein, Alfred M. editor.
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https://doi.org/10.1007/978-981-19-2600-6
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5. 
Cover image for Information and Communication Technology for Competitive Strategies (ICTCS 2022) Intelligent Strategies for ICT
Information and Communication Technology for Competitive Strategies (ICTCS 2022) Intelligent Strategies for ICT
Author 
Kaiser, M. Shamim. editor. Xie, Juanying. editor. Rathore, Vijay Singh. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9304-6
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6. 
Cover image for Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2
Intelligence of Things: Technologies and Applications The Second International Conference on Intelligence of Things (ICIT 2023), Ho Chi Minh City, Vietnam, October 25-27, 2023, Proceedings, Volume 2
Author 
Dao, Nhu-Ngoc. editor. Thinh, Tran Ngoc. editor. Nguyen, Ngoc Thanh. editor. (orcid)0000-0002-3247-2948 SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-46749-3
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7. 
Cover image for Distributed Computing and Artificial Intelligence, Special Sessions II - Intelligent Systems Applications, 20th International Conference
Distributed Computing and Artificial Intelligence, Special Sessions II - Intelligent Systems Applications, 20th International Conference
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Jove, Esteban. editor. Zayas-Gato, Francisco. editor. Michelena, Álvaro. editor. Calvo-Rolle, José Luis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38616-9
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8. 
Cover image for AI Embedded Assurance for Cyber Systems
AI Embedded Assurance for Cyber Systems
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Wang, Cliff. editor. Iyengar, S.S. editor. Sun, Kun. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-42637-7
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9. 
Cover image for Vibration Engineering and Technology of Machinery, Volume I Select Proceedings of VETOMAC XVI 2021
Vibration Engineering and Technology of Machinery, Volume I Select Proceedings of VETOMAC XVI 2021
Author 
Tiwari, Rajiv. editor. Ram Mohan, Y. S. editor. Darpe, Ashish K. editor. Kumar, V. Arun. editor. Tiwari, Mayank. editor.
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https://doi.org/10.1007/978-981-99-4721-8
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10. 
Cover image for Smart Trends in Computing and Communications Proceedings of SmartCom 2023, Volume 1
Smart Trends in Computing and Communications Proceedings of SmartCom 2023, Volume 1
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Senjyu, Tomonobu. editor. So-In, Chakchai. editor. Joshi, Amit. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0769-4
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11. 
Cover image for Machine Learning and Intelligent Communication 7th EAI International Conference, MLICOM 2022, Virtual Event, October 23-24, 2022, Proceedings
Machine Learning and Intelligent Communication 7th EAI International Conference, MLICOM 2022, Virtual Event, October 23-24, 2022, Proceedings
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Jiang, Xiaolin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-30237-4
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12. 
Cover image for Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part I
Computer Science and Education 17th International Conference, ICCSE 2022, Ningbo, China, August 18-21, 2022, Revised Selected Papers, Part I
Author 
Hong, Wenxing. editor. Weng, Yang. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-2443-1
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