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37. 
Cover image for 1st International Conference on Civil, Architecture, Environmental Engineering, and Technology
1st International Conference on Civil, Architecture, Environmental Engineering, and Technology
Author 
Awang, Mokhtar. editor. (orcid)0000-0001-8032-6980 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-94347-8
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38. 
Cover image for Proceedings of the 6th Yogyakarta International Seminar on Health, Physical Education, and Sports Science YISHPESS 2024, 16 September, Indonesia
Proceedings of the 6th Yogyakarta International Seminar on Health, Physical Education, and Sports Science YISHPESS 2024, 16 September, Indonesia
Author 
Pratama, Kukuh Wahyudin. editor. Mustapha, Aida. editor. (orcid)0000-0002-9077-4995 Ali, Syed Kamaruzaman Syed. editor. Karakauki, Manil. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-96-8249-2
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39. 
Cover image for Advances in Material Science and Engineering Selected Articles from ICMMPE 2022
Advances in Material Science and Engineering Selected Articles from ICMMPE 2022
Author 
Awang, Mokhtar. editor. Al-Kayiem, Hussain H. editor. Bor, Ton C. editor. (orcid)0000-0003-1173-1186 Emamian, Seyed Sattar. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-5318-9
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40. 
Cover image for Collaborative Research Advancing Engineering Solutions for Real-World Challenges The 2023 Postgraduate Seminar in Esslingen
Collaborative Research Advancing Engineering Solutions for Real-World Challenges The 2023 Postgraduate Seminar in Esslingen
Author 
Öchsner, Andreas. editor. (orcid)0000-0002-8844-3206 SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-031-48521-3
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41. 
Cover image for Advances in Material Science and Engineering Selected articles from ICMMPE 2023, 16-Nov, Putrajaya, Malaysia
Advances in Material Science and Engineering Selected articles from ICMMPE 2023, 16-Nov, Putrajaya, Malaysia
Author 
Emamian, Sattar S. editor. (orcid)0000-0001-5488-4217 Awang, Mokhtar. editor. Al-Kayiem, Hussain H. editor. (orcid)0000-0002-6045-8553 SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-97-2015-6
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42. 
Cover image for 3GPP-based non-terrestrial networks in 5G and 6G : expanding the frontiers of wireless communications
3GPP-based non-terrestrial networks in 5G and 6G : expanding the frontiers of wireless communications
Author 
Tripathi, Nishith D., author. Reed, Jeffrey Hugh, author.
Preferred Shelf Number 
TK5104 .T75 2026
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394203413
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43. 
Cover image for Navigating technology and national security : the intersection of CFIUS, Team Telecom, AI controls, and other regulations
Navigating technology and national security : the intersection of CFIUS, Team Telecom, AI controls, and other regulations
Author 
Sherman, Justin, author.
Preferred Shelf Number 
KF1976 .S54 2026
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394332991
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44. 
Cover image for Microbubbles : Engineering Aspects and Industrial Applications.
Microbubbles : Engineering Aspects and Industrial Applications.
Author 
Khuntia, Snigdha.
Preferred Shelf Number 
QC161
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394249411
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45. 
Cover image for Driving innovation through AI and digital twin for 6G powered sustainable ultra smart cities
Driving innovation through AI and digital twin for 6G powered sustainable ultra smart cities
Author 
Taneja, Ashu, editor.
Preferred Shelf Number 
TD159.4 .D75 2025
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394411320
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46. 
Cover image for Agro-Waste Management and Valorization.
Agro-Waste Management and Valorization.
Author 
Agrawal, Pratibha S. Agrawal, Pratibha S./Tiwari, Rich. Belkhode, Pramod N.
Preferred Shelf Number 
XX(600394.1)
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527854226
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47. 
Cover image for Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Artificial Plasmonics for VLSI Interconnects : Bridging the Gap Between Electronics and Optics.
Author 
Joy, Soumitra R.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394290000
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48. 
Cover image for Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 2 Fluid Dynamics
Proceedings of Fluid Mechanics and Fluid Power (FMFP) 2023, Vol. 2 Fluid Dynamics
Author 
Kothadia, Hardik. editor. Arun, K. R. editor. Rajesh, G. editor. (orcid)0000-0003-4518-9727 Arakeri, Jaywant H. editor. SpringerLink (Online service)
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ONLINE
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https://doi.org/10.1007/978-981-97-6783-0
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