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37. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume III
Author 
Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. Li, Jian. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-99-0408-2
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38. 
Cover image for Power GaN Devices Materials, Applications and Reliability
Power GaN Devices Materials, Applications and Reliability
Author 
Meneghini, Matteo. editor. Meneghesso, Gaudenzio. editor. Zanoni, Enrico. editor. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-3-319-43199-4
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39. 
Cover image for Modular Load Flow for Restructured Power Systems
Modular Load Flow for Restructured Power Systems
Author 
Hariharan, M.V. author. Varwandkar, S.D. author. Gupta, Pragati P. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-0497-1
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40. 
Cover image for FPGA Based Accelerators for Financial Applications
FPGA Based Accelerators for Financial Applications
Author 
De Schryver, Christian. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-15407-7
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41. 
Cover image for Thermal Transport in Oblique Finned Micro/Minichannels
Thermal Transport in Oblique Finned Micro/Minichannels
Author 
Fan, Yan. author. Lee, Poh Seng. author. Singh, Pawan Kumar. author. Lee, Yong Jiun. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09647-6
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42. 
Cover image for Atomic Layer Deposition for Semiconductors
Atomic Layer Deposition for Semiconductors
Author 
Hwang, Cheol Seong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-8054-9
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