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37. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Molecular Modeling and Multiscaling Issues for Electronic Material Applications Volume 2
Author 
Wymyslowski, Artur. editor. Iwamoto, Nancy. editor. Yuen, Matthew. editor. Fan, Haibo. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12862-7
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38. 
Cover image for Analysis and Design of Networks-on-Chip Under High Process Variation
Analysis and Design of Networks-on-Chip Under High Process Variation
Author 
Ezz-Eldin, Rabab. author. El-Moursy, Magdy Ali. author. Hamed, Hesham F. A. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-25766-2
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39. 
Cover image for Active Cancellation of Probing in Linear Dipole Phased Array
Active Cancellation of Probing in Linear Dipole Phased Array
Author 
Singh, Hema. author. Ankaiah, N. Bala. author. Jha, Rakesh Mohan. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-287-829-8
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40. 
Cover image for Trusted Computing for Embedded Systems
Trusted Computing for Embedded Systems
Author 
Candaele, Bernard. editor. Soudris, Dimitrios. editor. Anagnostopoulos, Iraklis. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-09420-5
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41. 
Cover image for Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Advancements of Medical Electronics Proceedings of the First International Conference, ICAME 2015
Author 
Gupta, Somsubhra. editor. Bag, Sandip. editor. Ganguly, Karabi. editor. Sarkar, Indranath. editor. Biswas, Papun. editor.
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https://doi.org/10.1007/978-81-322-2256-9
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42. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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43. 
Cover image for Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Precision Assembly Technologies and Systems 6th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2012, Chamonix, France, February 12-15, 2012. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28163-1
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44. 
Cover image for Mechatronic Systems Analysis, Design and Implementation
Mechatronic Systems Analysis, Design and Implementation
Author 
Boukas, El-Kébir. author. AL-Sunni, Fouad M. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22324-2
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45. 
Cover image for Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Precision Assembly Technologies and Systems 5th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2010, Chamonix, France, February 14-17, 2010. Proceedings
Author 
Ratchev, Svetan. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-11598-1
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46. 
Cover image for Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Languages for Embedded Systems and their Applications Selected Contributions on Specification, Design, and Verification from FDL’08
Author 
Radetzki, Martin. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4020-9714-0
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47. 
Cover image for Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Integrated System-Level Modeling of Network-on-Chip enabled Multi-Processor Platforms
Author 
Kogel, Tim. author. Leupers, Rainer. author. Meyr, Heinrich. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/1-4020-4826-2
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48. 
Cover image for Advances in Design and Specification Languages for SoCs Selected Contributions from FDL’04
Advances in Design and Specification Languages for SoCs Selected Contributions from FDL’04
Author 
Boulet, Pierre. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b136935
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