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Author

Jaeger, Richard C.

(5)

Wiley InterScience (Online service)

(4)

Blalock, Travis N.

(3)

Brown, William D., 1943-

(3)

SpringerLink (Online service)

(3)

Brewer, Joe (Joe E.)

(2)

IEEE Circuits and Systems Society.

(2)

IEEE Solid-State Circuits Society.

(2)

Ulrich, Richard K. (Richard Kevin), 1955-

(2)

?saka, Tetsuya, 1945-

(1)

Ahsan, Tanweer, editor.

(1)

American Chemical Society. Division of Polymeric Materials: Science and Engineering.

(1)

Andreou, Andreas G.

(1)

Baker, R. Jacob, 1964-

(1)

Ballantyne, J. P.

(1)

Bhushan, Manjul. author.

(1)

Blalock, Travis N., ort. yaz.

(1)

Brand, Oliver. author.

(1)

Brewer, George Raymond, 1922-

(1)

Cheeke, J. David N.

(1)

(1)

Chen, Jing, 1974-

(1)

Choudhary, Vikas.

(1)

Components, Packaging & Manufacturing Technology Society.

(1)

(1)

Elst, Günter. editor.

(1)

Fleetwood, Daniel.

(1)

(1)

(1)

Gutmann, Ronald J.

(1)

Hanke, Randolf. editor.

(1)

Heuberger, Albert. editor.

(1)

Horie, Kazuyuki, 1941-

(1)

Iniewski, Krzysztof.

(1)

Ito, Hiroshi, ed.

(1)

Jim�enez, J. (Juan)

(1)

(1)

John Wiley & Sons.

(1)

Karimi-Ghartemani, Masoud, author.

(1)

Kaya, İbrahim.

(1)

Ketchen, Mark B. author.

(1)

(1)

Kåobunshi Gakkai (Japan). Polymers for Microelectronics and Photonics Group.

(1)

(1)

Liu, S. (Sheng), 1963-

(1)

(1)

Liu, Yong, 1962-

(1)

(1)

(1)

Makabe, T. (Toshiaki)

(1)

Makabe, T. (Toshiaki), author.

(1)

Marcus, P. (Philippe), 1953-

(1)

Mayer, Michael. author.

(1)

Mittal, K. L., 1945- editor.

(1)

(1)

Oklobdzija, Vojin G.

(1)

Pantelides, Sokrates T.

(1)

Pecht, Michael.

(1)

Pereira, Oswyn.

(1)

(1)

Petrovi¿̐ưc, Z., author.

(1)

Puttlitz, Karl J.

(1)

Ramaswami, Sesh.

(1)

(1)

Rossnagel, Stephen M.

(1)

Ruska, W. Scot.

(1)

Schrimpf, Ronald Donald.

(1)

Schultze, J. W. (Joachim Walter)

(1)

Schwizer, Jürg. author.

(1)

Sedra, Adel S., author.

(1)

(1)

Smith, Kenneth C. (Kenneth Carless), author.

(1)

Stalter, Kathleen A.

(1)

Steigerwald, Joseph M.

(1)

Strong, Alvin Wayne, 1946-

(1)

Suganuma, Katsuaki, editor.

(1)

Sánchez-Sinencio, Edgar.

(1)

Tagawa, Seichi, ed.

(1)

(1)

Wang, Zhiping, 1962- Oct. 6-

(1)

Waynant, Ronald W.

(1)

(1)

(1)

Yang, Edward S.

(1)

Özerdem, Mehmet Siraç, çeviri editörü

(1)

Language

(36)

(2)

Publication Date

-

(8)

(4)

(3)

(3)

(3)

(2)

(2)

(2)

(2)

(2)

(2)

(2)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

(1)

Subject

Microelectronic packaging.

(11)

Electronic books.

(9)

Integrated circuits -- Design and construction.

(6)

Semiconductors -- Design and construction.

(5)

Electronic circuit design.

(3)

Microelectronics.

(3)

Mikroelektronik.

(3)

Chemical mechanical planarization.

(2)

Electronic circuits.

(2)

Electronic packaging.

(2)

(2)

Low voltage integrated circuits.

(2)

Microelectromechanical systems.

(2)

Microelectronics -- Materials.

(2)

MİKROELEKTRONİK.

(2)

Optical materials.

(2)

Optoelectronic devices.

(2)

Plasma engineering.

(2)

Systems engineering.

(2)

İNTEGRE DEVRELER -- ÇİZİM VE YAPIM.

(2)

Adhesive joints.

(1)

(1)

Appareil électronique.

(1)

CMOS (Circuit intégré)

(1)

CMOS-Schaltung.

(1)

(1)

Chip scale packaging.

(1)

Circuit intégré à faible consommation.

(1)

Circuit intégré à très grande échelle.

(1)

Circuit logique.

(1)

Circuit électronique.

(1)

Computer network architectures.

(1)

Computer science.

(1)

Corrosion and anti-corrosives.

(1)

Dispositif optoélectronique.

(1)

Electric connectors.

(1)

Electric power systems -- Equipment and supplies.

(1)

Electronic apparatus and appliances -- Design and construction.

(1)

Electronic apparatus and appliances.

(1)

Elektronenstrahllithographie.

(1)

Elektronik devreler.

(1)

(1)

Environmental protection.

(1)

(1)

Flash memories (Computers)

(1)

Frequency synthesizers.

(1)

Green products.

(1)

Grinding and polishing.

(1)

High performance processors -- Design and construction.

(1)

High power lasers.

(1)

ISI -- İLETİM.

(1)

Integrated circuits -- Defects.

(1)

Integrated circuits -- Very large scale integration -- Design and construction -- Textbooks.

(1)

Integrated circuits industry.

(1)

Lithography, Electron beam.

(1)

Logic circuits.

(1)

MIKROELEKTRONIK.

(1)

Metal oxide semiconductor field-effect transistors -- Testing.

(1)

Metal oxide semiconductor field-effect transistors.

(1)

Metal oxide semiconductors, Complementary -- Design and construction.

(1)

Metal oxide semiconductors, Complementary -- Reliability.

(1)

Metal oxide semiconductors, Complementary.

(1)

Microelectronic packaging -- Materials.

(1)

Microelectronic packaging -- Simulation methods.

(1)

Microelectronic.

(1)

Microelectronics -- Materials -- Congresses.

(1)

Microelectronics -- Materials -- Testing.

(1)

Microprogramming.

(1)

Mikroelektronik -- Maddele -- Kongreler.

(1)

Mise sous boîtier (Microélectronique)

(1)

Mise sous boîtier (Électronique)

(1)

Multichip modules (Microelectronics)

(1)

Mémoire à semiconducteurs.

(1)

(1)

Nanostructured materials.

(1)

Nanotechnology.

(1)

Passive components.

(1)

Phase-locked loops.

(1)

Photoluminescence.

(1)

(1)

Polymers -- Congresses.

(1)

Power electronics.

(1)

Printed circuits -- Equipment and supplies.

(1)

(1)

Schaltungsentwurf.

(1)

Semiconductor lasers.

(1)

Semiconductor storage devices.

(1)

Software engineering.

(1)

Solder and soldering.

(1)

Strains and stresses -- Measurement.

(1)

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Digital.

(1)

TECHNOLOGY & ENGINEERING -- Electronics -- Microelectronics.

(1)

TECHNOLOGY & ENGINEERING / Microwaves

(1)

Thin films -- Computer simulation -- Congresses.

(1)

Three-dimensional integrated circuits -- Computer-aided design.

(1)

Three-dimensional integrated circuits -- Design and construction.

(1)

Three-dimensional integrated circuits -- Testing.

(1)

Three-dimensional integrated circuits.

(1)

Timing circuits.

(1)

Ultrasonic waves -- Industrial applications.

(1)

Ultrasonic waves.

(1)

Very high speed integrated circuits.

(1)

Wide gap semiconductors.

(1)

YARIİLETKENLER -- ÇİZİM VE YAPIM.

(1)

YARIİLETKENLER.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Library

Beytepe Library

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37.

Cover image for Adhesion in microelectronics

Adhesion in microelectronics

Adhesion in microelectronics

Author

Mittal, K. L., 1945- editor. Ahsan, Tanweer, editor.

Preferred Shelf Number

ONLINE(341844.1)

Electronic Access

ebrary An electronic book accessible through the World Wide Web; click to view
Ebook Library http://public.eblib.com/choice/PublicFullRecord.aspx?p=1767917
John Wiley http://dx.doi.org/10.1002/9781118831373

Format:

Availability

Online Library~1

Available:
Copies:

38.

Cover image for MEMS fundamental technology and applications

MEMS fundamental technology and applications

MEMS fundamental technology and applications

Author

Choudhary, Vikas. Iniewski, Krzysztof.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

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39.

Cover image for Semiconductor packaging materials interaction and reliability

Semiconductor packaging materials interaction and reliability

Semiconductor packaging materials interaction and reliability

Author

Chen, Andrea. Lo, Randy.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

Availability

Online Library~1

Available:
Copies:

40.

Cover image for Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Fundamentals and applications of ultrasonic waves

Author

Cheeke, J. David N.

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

Format:

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41.

Cover image for Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Corrosion mechanisms in theory and practice

Author

Marcus, P. (Philippe), 1953-

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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42.

Cover image for 3D IC stacking technology

3D IC stacking technology

3D IC stacking technology

Author

Wu, Banqiu. Kumar, Ajay. Ramaswami, Sesh.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

Format:

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Online Library~1

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43.

Cover image for Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Introduction to microsystem packaging technology

Author

Jin, Yufeng. Wang, Zhiping, 1962- Oct. 6- Chen, Jing, 1974-

Preferred Shelf Number

ONLINE

Electronic Access

Distributed by publisher. Purchase or institutional license may be required for access.

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44.

Cover image for Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Quantum-well laser array packaging nanoscale packaging techniques

Author

Tomm, Jens W. Jim�enez, J. (Juan)

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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45.

Cover image for MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

MEMS/MOEMS packaging concepts, designs, materials, and processes

Author

Gilleo, Ken.

Preferred Shelf Number

ONLINE

Electronic Access

Subscription required

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46.

Cover image for Advanced electronic packaging

Advanced electronic packaging

Advanced electronic packaging

Author

Brown, William D., 1943- Ulrich, Richard K. (Richard Kevin), 1955-

Preferred Shelf Number

ONLINE

Format:

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47.

Cover image for IC component sockets

IC component sockets

IC component sockets

Author

Liu, Weifeng. Pecht, Michael. John Wiley & Sons.

Preferred Shelf Number

ONLINE

Electronic Access

John Wiley http://dx.doi.org/10.1002/0471648272
Contributor biographical information http://catdir.loc.gov/catdir/bios/wiley046/2004043361.html

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