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37. 
Cover image for Nonvolatile memory technologies with emphasis on Flash a comprehensive guide to understanding and using NVM devices
Nonvolatile memory technologies with emphasis on Flash a comprehensive guide to understanding and using NVM devices
Author 
Brewer, Joe (Joe E.) Gill, Manzur.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5201541
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38. 
Cover image for High-performance system design circuits and logic
High-performance system design circuits and logic
Author 
Oklobdzija, Vojin G. IEEE Circuits and Systems Society. IEEE Solid-State Circuits Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5265197
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39. 
Cover image for Low-voltage/low-power integrated circuits and systems low-voltage mixed-signal ciruits
Low-voltage/low-power integrated circuits and systems low-voltage mixed-signal ciruits
Author 
Sánchez-Sinencio, Edgar. Andreou, Andreas G. IEEE Solid-State Circuits Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5264057
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40. 
Cover image for Electronic and photonic circuits and devices
Electronic and photonic circuits and devices
Author 
Waynant, Ronald W. Lowell, John. IEEE Circuits and Systems Society. Components, Packaging & Manufacturing Technology Society.
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263558
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41. 
Cover image for Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices
Nonvolatile semiconductor memory technology a comprehensive guide to understanding and to using NVSM devices
Author 
Brown, William D., 1943- Brewer, Joe (Joe E.)
Preferred Shelf Number 
ONLINE
Electronic Access 
IEEE Xplore http://ieeexplore.ieee.org/xpl/bkabstractplus.jsp?bkn=5263122
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42. 
Cover image for Reliability prediction for microelectronics
Reliability prediction for microelectronics
Author 
Bernstein, Joseph B., author. Bensoussan, Alain A., author. Bender, Emmanuel (Carl), author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394210961
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43. 
Cover image for Thermal spreading and contact resistance : fundamentals and applications
Thermal spreading and contact resistance : fundamentals and applications
Author 
Muzychka, Yuri, author. Yovanovich, M. Michael (Milan Michael), author.
Preferred Shelf Number 
QC320.2 .M89 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394187560
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44. 
Cover image for Practical ESD protection design
Practical ESD protection design
Author 
Wang, Albert Z. H., 1962- author.
Preferred Shelf Number 
TK7874
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119850434
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45. 
Cover image for Integrated smart micro-systems towards personalized healthcare
Integrated smart micro-systems towards personalized healthcare
Author 
Song, Yujun, author. Gao, Wei, author. Zhang, Haixia, author.
Preferred Shelf Number 
R855.3
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527833474
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46. 
Cover image for Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells
Thermal design : heat sinks, thermoelectrics, heat pipes, compact heat exchangers, and solar cells
Author 
Lee, HoSung, author.
Preferred Shelf Number 
TJ255.5 .L44 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119686040
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47. 
Cover image for Reliability and Physics-Of-Healthy in Mechatronics.
Reliability and Physics-Of-Healthy in Mechatronics.
Author 
El Hami, Abdelkhalak. Delaux, David. Grzeskowiak, Henri.
Preferred Shelf Number 
TA169 .E515 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394186068
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48. 
Cover image for Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Embedded and fan-out wafer and panel level packaging technologies for advanced application spaces : high performance compute and system-in-package
Author 
Keser, Beth, 1971- editor. Kröhnert, Steffen, editor.
Preferred Shelf Number 
TK7870.15 .E43 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119793908
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