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37. 
Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
Author 
Iyer, S. S., ed. Auberton-Herv�, A. J., e
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP001E
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38. 
Cover image for Process Technology for Silicon Carbide Devices
Process Technology for Silicon Carbide Devices
Author 
Zetterling, Carl-Mikael, ed.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://dx.doi.org/10.1049/PBEP002E
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39. 
Cover image for Micro flows : fundamentals and simulation
Micro flows : fundamentals and simulation
Author 
Karniadakis, George. Beskok, Ali, 1966- ort. yaz.
Preferred Shelf Number 
TA 357 K36 2002
Format: 
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Beytepe Library~1
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40. 
Cover image for Computational materials science the simulation of materials microstructures and properties
Computational materials science the simulation of materials microstructures and properties
Author 
Raabe, Dierk.
Preferred Shelf Number 
ONLINE
Electronic Access 
Click here to see page images available via Wiley.
John Wiley http://dx.doi.org/10.1002/3527601945
HathiTrust Digital Library Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/40821147.html
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41. 
Cover image for Damage mechanics
Damage mechanics
Author 
Krajcinovic, Dusan.
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ONLINE
Electronic Access 
ScienceDirect http://www.sciencedirect.com/science/book/9780444823496
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42. 
Cover image for Dynamic behavior of materials
Dynamic behavior of materials
Author 
Meyers, Marc A.
Preferred Shelf Number 
ONLINE
Electronic Access 
http://onlinelibrary.wiley.com/book/10.1002/9780470172278
John Wiley http://dx.doi.org/10.1002/9780470172278
HathiTrust Digital Library, Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/28854235.html
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