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37. 
Cover image for Electromagnetic Behaviour of Metallic Wire Structures
Electromagnetic Behaviour of Metallic Wire Structures
Author 
Chui, S. T. author. Zhou, Lei. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330920.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4159-4
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38. 
Cover image for Physical Layer Multi-Core Prototyping A Dataflow-Based Approach for LTE eNodeB
Physical Layer Multi-Core Prototyping A Dataflow-Based Approach for LTE eNodeB
Author 
Pelcat, Maxime. author. Aridhi, Slaheddine. author. Piat, Jonathan. author. Nezan, Jean-François. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330930.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4210-2
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39. 
Cover image for Photovoltaic Sources Modeling and Emulation
Photovoltaic Sources Modeling and Emulation
Author 
Di Piazza, Maria Carmela. author. Vitale, Gianpaolo. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330965.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4378-9
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40. 
Cover image for Embedded Multimedia Security Systems Algorithms and Architectures
Embedded Multimedia Security Systems Algorithms and Architectures
Author 
Pande, Amit. author. Zambreno, Joseph. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330984.1)
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http://dx.doi.org/10.1007/978-1-4471-4459-5
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41. 
Cover image for Advanced Flip Chip Packaging
Advanced Flip Chip Packaging
Author 
Tong, Ho-Ming. editor. Lai, Yi-Shao. editor. Wong, C.P. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330808.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-5768-9
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42. 
Cover image for Introduction to Biosensors From Electric Circuits to Immunosensors
Introduction to Biosensors From Electric Circuits to Immunosensors
Author 
Yoon, Jeong-Yeol. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330812.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6022-1
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43. 
Cover image for Integrated Optical Interconnect Architectures for Embedded Systems
Integrated Optical Interconnect Architectures for Embedded Systems
Author 
O'Connor, Ian. editor. Nicolescu, Gabriela. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330817.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-6193-8
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44. 
Cover image for Implementing Software Defined Radio
Implementing Software Defined Radio
Author 
Grayver, Eugene. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330849.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9332-8
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45. 
Cover image for Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Design for High Performance, Low Power, and Reliable 3D Integrated Circuits
Author 
Lim, Sung Kyu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(330852.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4419-9542-1
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46. 
Cover image for Tuneable Film Bulk Acoustic Wave Resonators
Tuneable Film Bulk Acoustic Wave Resonators
Author 
Gevorgian, Spartak Sh. author. Tagantsev, Alexander K. author. Vorobiev, Andrei K. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331105.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4471-4944-6
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47. 
Cover image for Dynamic Reconfiguration in Real-Time Systems Energy, Performance, and Thermal Perspectives
Dynamic Reconfiguration in Real-Time Systems Energy, Performance, and Thermal Perspectives
Author 
Wang, Weixun. author. Mishra, Prabhat. author. Ranka, Sanjay. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331237.1)
Electronic Access 
http://dx.doi.org/10.1007/978-1-4614-0278-7
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48. 
Cover image for Design and Testing of Digital Microfluidic Biochips
Design and Testing of Digital Microfluidic Biochips
Author 
Zhao, Yang. author. Chakrabarty, Krishnendu. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE(331239.1)
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http://dx.doi.org/10.1007/978-1-4614-0370-8
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