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37. 
Cover image for Multi-Net Optimization of VLSI Interconnect
Multi-Net Optimization of VLSI Interconnect
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Moiseev, Konstantin. author. Kolodny, Avinoam. author. Wimer, Shmuel. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-0821-5
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38. 
Cover image for Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Computational Advancement in Communication Circuits and Systems Proceedings of ICCACCS 2014
Author 
Maharatna, Koushik. editor. Dalapati, Goutam Kumar. editor. Banerjee, P K. editor. Mallick, Amiya Kumar. editor. Mukherjee, Moumita. editor.
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https://doi.org/10.1007/978-81-322-2274-3
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39. 
Cover image for Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
Innovations and Advances in Computing, Informatics, Systems Sciences, Networking and Engineering
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Sobh, Tarek. editor. Elleithy, Khaled. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-06773-5
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40. 
Cover image for Copper Electrodeposition for Nanofabrication of Electronics Devices
Copper Electrodeposition for Nanofabrication of Electronics Devices
Author 
Kondo, Kazuo. editor. Akolkar, Rohan N. editor. Barkey, Dale P. editor. Yokoi, Masayuki. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-9176-7
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