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1. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-19-7636-0
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2. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
Preferred Shelf Number 
ONLINE
Electronic Access 
https://doi.org/10.1007/978-981-99-3951-0
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3. 
Cover image for Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Electromechanical coupling theory, methodology and applications for high-performance microwave equipment
Author 
Duan, Baoyan, author. Zhang, Shuxin (Professor of electromechanical engineering), author.
Preferred Shelf Number 
TK7876 .D83 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119904427
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4. 
Cover image for 75th anniversary of the transistor
75th anniversary of the transistor
Author 
Nathan, Arokia, 1957- editor. Saha, Samar K., editor. Todi, Ravi M., editor.
Preferred Shelf Number 
TK7871.9
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394202478
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5. 
Cover image for Defects in organic semiconductors and devices
Defects in organic semiconductors and devices
Author 
Nguyen, Thien-Phap, author.
Preferred Shelf Number 
TK7871.99 .O74 N48 2023
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781394229451
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6. 
Cover image for Resilient power electronic systems
Resilient power electronic systems
Author 
Kaboli, Shahriyar, 1975- author. Peyghami, Saeed, author. Blaabjerg, Frede, author.
Preferred Shelf Number 
TK7881.15 .K335 2022
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119772217
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7. 
Cover image for Cellular V2X for connected automated driving
Cellular V2X for connected automated driving
Author 
Fallgren, Mikael, editor. Dillinger, Markus, editor. Mahmoodi, Toktam, editor. Svensson, Tommy (Highway engineer), editor.
Preferred Shelf Number 
TE228.37 .C45 2021
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119692676
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8. 
Cover image for Electrical connectors : design, manufacture, test, and selection
Electrical connectors : design, manufacture, test, and selection
Author 
Pecht, Michael, editor. Kyeong, San, editor.
Preferred Shelf Number 
TK3521
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119679837
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9. 
Cover image for Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Systems engineering in the fourth industrial revolution : big data, novel technologies, and modern systems engineering
Author 
Kenett, Ron, editor. Swarz, Robert S., editor. Zonnenshain, Avigdor, editor.
Preferred Shelf Number 
TA168 .S8727 2020
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119513957
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10. 
Cover image for Advances in embedded and fan-out wafer level packaging technologies
Advances in embedded and fan-out wafer level packaging technologies
Author 
Keser, Beth, 1971- editor. Kroehnert, Steffen, 1970- editor.
Preferred Shelf Number 
TK7870.17 .A38 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9781119313991
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11. 
Cover image for Handbook of 3D integration. Volume 4, Design, test, and thermal management
Handbook of 3D integration. Volume 4, Design, test, and thermal management
Author 
Franzon, Paul D., editor. Marinissen, Eric Jan, editor. Bakir, Muhannad S., editor.
Preferred Shelf Number 
TK7874.893 .H36 2019
Electronic Access 
https://onlinelibrary.wiley.com/doi/book/10.1002/9783527697052
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12. 
Cover image for 3D Microelectronic Packaging From Fundamentals to Applications
3D Microelectronic Packaging From Fundamentals to Applications
Author 
Li, Yan. editor. Goyal, Deepak. editor. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-3-319-44586-1
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