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1. 
Cover image for Chalcogenides Metastability and Phase Change Phenomena
Chalcogenides Metastability and Phase Change Phenomena
Author 
Kolobov, Alexander V. author. Tominaga, Junji. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-28705-3
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2. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Author 
Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
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http://dx.doi.org/10.1007/978-1-4471-2470-2
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3. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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4. 
Cover image for Photoelectrochemical Hydrogen Production
Photoelectrochemical Hydrogen Production
Author 
van de Krol, Roel. editor. Grätzel, Michael. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1380-6
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5. 
Cover image for Photophysics of Carbon Nanotubes Interfaced with Organic and Inorganic Materials
Photophysics of Carbon Nanotubes Interfaced with Organic and Inorganic Materials
Author 
Levitsky, Igor A. author. Euler, William B. author. Karachevtsev, Victor A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4471-4826-5
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6. 
Cover image for Electroactivity in Polymeric Materials
Electroactivity in Polymeric Materials
Author 
Rasmussen, Lenore. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0878-9
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7. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1728-6
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8. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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9. 
Cover image for Nanostructured Materials for Engineering Applications
Nanostructured Materials for Engineering Applications
Author 
Bergmann, Carlos Pérez. editor. Andrade, Mônica Jung. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-19131-2
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10. 
Cover image for Swift Heavy Ions for Materials Engineering and Nanostructuring
Swift Heavy Ions for Materials Engineering and Nanostructuring
Author 
Avasthi, D. K. author. Mehta, G. K. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-94-007-1229-4
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11. 
Cover image for The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
Author 
Grossmann, Günter. editor. Zardini, Christian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-236-0
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12. 
Cover image for Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
Author 
Tan, Cher Ming. author. Li, Wei. author. Gan, Zhenghao. author. Hou, Yuejin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-0-85729-310-7
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