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1. 
Cover image for Data-Driven Scheduling of Semiconductor Manufacturing Systems
Data-Driven Scheduling of Semiconductor Manufacturing Systems
Author 
Li, Li. author. Yu, Qingyun. author. Lin, Kuo-Yi. author. Ma, Yumin. author. Qiao, Fei. author.
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Electronic Access 
https://doi.org/10.1007/978-981-19-7588-2
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2. 
Cover image for Software Defined Chips Volume II
Software Defined Chips Volume II
Author 
Liu, Leibo. author. Wei, Shaojun. author. Zhu, Jianfeng. author. Deng, Chenchen. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-7636-0
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3. 
Cover image for Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Design for Electromagnetic Compatibility--In a Nutshell Theory and Practice
Author 
Keller, Reto B. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-14186-7
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4. 
Cover image for Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Micro and Nanoelectronics Devices, Circuits and Systems Select Proceedings of MNDCS 2022
Author 
Lenka, Trupti Ranjan. editor. Misra, Durgamadhab. editor. Fu, Lan. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-2308-1
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5. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume II
Author 
Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. Yang, Qingxin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0451-8
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6. 
Cover image for Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Silicon Semiconductor Technology Processing and Integration of Microelectronic Devices
Author 
Hilleringmann, Ulrich. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-41041-4
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7. 
Cover image for Chiplet Design and Heterogeneous Integration Packaging
Chiplet Design and Heterogeneous Integration Packaging
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Lau, John H. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-19-9917-8
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8. 
Cover image for The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
The Proceedings of the 17th Annual Conference of China Electrotechnical Society Volume I
Author 
Yang, Qingxin. editor. Li, Jian. editor. Xie, Kaigui. editor. Hu, Jianlin. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-0357-3
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9. 
Cover image for Introduction to Avionics Systems
Introduction to Avionics Systems
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Collinson, R.P.G. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-29215-6
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10. 
Cover image for Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology Design and Simulation
Author 
Wu, Yongle. author. Wang, Weimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-1455-5
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11. 
Cover image for Integrated Electronic Payment Technologies for Smart Cities
Integrated Electronic Payment Technologies for Smart Cities
Author 
Graham, Don. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-38222-2
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12. 
Cover image for Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Proceeding of 2022 International Conference on Wireless Communications, Networking and Applications (WCNA 2022)
Author 
Qian, Zhihong. editor. Jabbar, M.A. editor. Cheung, Simon K. S. editor. Li, Xiaolong. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-99-3951-0
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