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SpringerLink (Online service)

(17)

Wiley InterScience (Online service)

(5)

Gross, Dietmar. author.

(3)

Seelig, Thomas. author.

(3)

Hausselt, Jürgen.

(2)

(2)

Michler, Goerg H. (Goerg Hannes)

(2)

Wang, Linbing, 1963-

(2)

(1)

Aboudi, Jacob, 1935-

(1)

American Society of Civil Engineers.

(1)

Ananthasuresh, Gondi Kondaiah. editor.

(1)

Annual Congress on Advanced Engineering and Technology (CAET) (2014 : Hong Kong). author.

(1)

(1)

Auberton-Herv�, A. J., e

(1)

Bai, Y. L. editor.

(1)

Baidyk, Tatiana. author.

(1)

Balta-Calleja, F. J.

(1)

Baltá-Calleja, F. J.

(1)

Bednarcyk, Brett A.

(1)

Berg, A. van den (Albert)

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Berlin, Charles I., ed.

(1)

Beskok, Ali, 1966- ort. yaz.

(1)

Blackwell, Glenn R.

(1)

Bobbin, Richard P., ed.

(1)

Butcher, Cliff. author.

(1)

Cambou, Bernard.

(1)

Chau, Kam-Tim. editor.

(1)

Chen, Y. Y. (Yiyi)

(1)

Chen, Zengtao. author.

(1)

Cherkaoui, Mohammed.

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Corves, Burkhard. editor.

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Dvorak, George. author.

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GeoShanghai International Conference (2010)

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Ghiocel, Dan M.

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Huang, Dianjian, editor.

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Institute of Electrical and Electronics Engineers.

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International Conference on Modelling and Computation in Engineering (2010 : Hong Kong, China)

(1)

International Symposium on Tubular Structures (12th : 2008 : Shanghai)

(1)

Iyer, S. S., ed.

(1)

Jean, Michel, 1940-

(1)

Jones, Robert M., author.

(1)

Kachanov, Mark. author.

(1)

Kandlikar, S. G. (Satish G.)

(1)

Karniadakis, George.

(1)

Kishore Kumar, S. editor.

(1)

Kondo, Djimédo.

(1)

Krajcinovic, Dusan.

(1)

Kussul, Ernst. author.

(1)

(1)

(1)

Meguid, Shaker A. editor.

(1)

Meier, Roger (Roger W.)

(1)

Meyers, Marc A.

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Mishnaevsky, Leon. author.

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Nait-Abdelaziz, Moussa.

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Nikolaidis, Efstratios.

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Oosterbroek, R. Edwin.

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Petuya, Victor. editor.

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Radjaï, Farhang.

(1)

Raghunandan, B. N. editor.

(1)

Schmauder, Siegfried. author.

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Sevostianov, Igor. author.

(1)

Shen, Z. Y. (Zu-yan)

(1)

Sih, G. C. (George C.)

(1)

Singhal, Suren.

(1)

Sivaramakrishna, Gullapalli. editor.

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Stupkiewicz, Stanisław. author.

(1)

Tai-Ran Hsu, ed.

(1)

Titterton, David

(1)

Totten, George E.

(1)

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Ulm, F.-J. (Franz-Josef)

(1)

Voyiadjis, George Z. author.

(1)

Voyiadjis, George Z. editor.

(1)

Vu-Khanh, Toan.

(1)

Wei, Y. G. editor.

(1)

Weng, George J. editor.

(1)

(1)

Wriggers, Peter. editor.

(1)

Wunsch, Donald C. author.

(1)

Xie, Liquan, 1972- editor.

(1)

Zetterling, Carl-Mikael, ed.

(1)

Zhao, Jidong. editor.

(1)

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Subject

Micromechanics.

(16)

(9)

(8)

(8)

Surfaces (Physics).

(7)

Mechanical engineering.

(5)

Mechanics, Applied.

(4)

Computer science.

(3)

Engineering design.

(3)

Nanotechnology.

(3)

(2)

Aerospace engineering.

(2)

(2)

Ceramic materials -- Microstructure.

(2)

Composite materials.

(2)

Continuum Mechanics and Mechanics of Materials.

(2)

Deformations (Mechanics)

(2)

Electronic books.

(2)

Metals -- Microstructure.

(2)

Micromechanics -- Mathematical models.

(2)

Microtechnology.

(2)

Aerospace Technology and Astronautics.

(1)

Analytical biochemistry.

(1)

Artificial intelligence.

(1)

Asphalt -- Mechanical properties.

(1)

Asphalt -- Microstructure.

(1)

(1)

Building materials.

(1)

Capteurs (technologie)

(1)

Ceramic materials.

(1)

Ceramics, Glass, Composites, Natural Methods.

(1)

(1)

Characterization and Evaluation of Materials.

(1)

Chemical detectors.

(1)

Classical Mechanics.

(1)

Composite materials -- Mechanical properties -- Mathematical models.

(1)

(1)

Computer vision.

(1)

Condensed matter.

(1)

Continuum damage mechanics.

(1)

Continuum mechanics -- Congresses.

(1)

(1)

(1)

(1)

(1)

Diodes, Schottky-barrier.

(1)

Dispositifs électromécaniques.

(1)

Electric resistance.

(1)

Electroacoustic transducers.

(1)

Electronic apparatus and appliances.

(1)

Electronic packaging -- Handbooks, manuals, etc.

(1)

Electronic packaging.

(1)

(1)

Engine Technology.

(1)

Engineering -- Congresses.

(1)

Engineering -- Data processing -- Congresses.

(1)

Engineering -- Mathematical models -- Congresses.

(1)

Engineering Mechanics.

(1)

Engineering Thermodynamics, Heat and Mass Transfer.

(1)

(1)

(1)

(1)

Fluid mechanics.

(1)

Fluidic devices.

(1)

Fracture mechanics -- Congresses.

(1)

(1)

Geotechnical Engineering and Applied Earth Sciences.

(1)

Geotechnical engineering.

(1)

Granular materials -- Mechanical properties.

(1)

Granular materials -- Microstructure.

(1)

Grinding and polishing.

(1)

Hair Cells -- physiology.

(1)

Heat -- Transmission.

(1)

Heat engineering.

(1)

Heat exchangers -- Fluid dynamics.

(1)

Heat exchangers.

(1)

(1)

Inertial navigation.

(1)

Injection molding of ceramics.

(1)

Injection molding of metals.

(1)

Integrated circuits--Very large scale integration.

(1)

Ion implantation.

(1)

KIL HÜCRELERİ -- FİZYOLOJİ.

(1)

(1)

(1)

Materials Science

(1)

Materials science -- Simulation methods.

(1)

Materials science.

(1)

(1)

(1)

Mechanical wear.

(1)

(1)

Mechanics, applied.

(1)

Mechanische Eigenschaft.

(1)

Metaller -- Mikroyapı.

(1)

Microchemistry -- Equipment and supplies.

(1)

Microchemistry -- Equipment and supplies. Fluidic devices. Micromechanics. Analytical biochemistry.

(1)

Microelectromechanical systems -- Materials -- Textbooks.

(1)

Microelectromechanical systems.

(1)

Microelectronics.

(1)

Microfabrication.

(1)

Micromechanics -- Mathematical models -- Congresses.

(1)

Micromechanics -- Textbooks.

(1)

Micromécanique.

(1)

Microprocessors.

(1)

Microstructure -- Congresses.

(1)

Microstructure -- Mathematical models.

(1)

Microstructure.

(1)

(1)

(1)

Mikroteknoloji.

(1)

MİKROMEKANİK.

(1)

Nanostructured materials -- Mechanical properties -- Textbooks.

(1)

Nanostructured materials.

(1)

(1)

Numerical analysis.

(1)

Offshore Engineering.

(1)

Offshore structures.

(1)

Ohmic contacts.

(1)

Optical pattern recognition.

(1)

(1)

(1)

(1)

Polymers -- Mechanical properties.

(1)

Polymers -- Microstructure.

(1)

(1)

Porous materials -- Mechanical properties -- Mathematical models.

(1)

Porous materials -- Mechanical properties.

(1)

Power semiconductors.

(1)

Reliability (Engineering)

(1)

SIVI MEKANİĞİ.

(1)

Sealing (Technology).

(1)

Semiconductor wafers.

(1)

Semiconductors--Junctions.

(1)

Semiconductors.

(1)

Seramik gereçler -- Mikroyapı.

(1)

Silicon compounds.

(1)

Silicon-on-insulator technology.

(1)

(1)

Soil mechanics -- Congresses.

(1)

Soil micromorphology -- Congresses.

(1)

Solid Mechanics.

(1)

(1)

Structural Materials.

(1)

Surfaces (Technology)

(1)

Technology -- Congresses.

(1)

Telecommunication.

(1)

Temperature measuring instruments.

(1)

Thermodynamics.

(1)

(1)

Tubular steel structures -- Congresses.

(1)

(1)

Wide gap semiconductors.

(1)

Material Type

Shelf Location

Beytepe General Collection

Electronic Library

Sağlık Bilimleri Genel Koleksiyon

Library

Beytepe Library

Health Sciences Library

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37.

Cover image for Microengineering of metals and ceramics

Microengineering of metals and ceramics

Microengineering of metals and ceramics

Author

Löhe, Detlef. Hausselt, Jürgen.

Preferred Shelf Number

QC176.8.M5 M53 2005 V.4/PT.2

Format:

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Beytepe Library~2

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38.

Cover image for Microengineering of metals and ceramics

Microengineering of metals and ceramics

Microengineering of metals and ceramics

Author

Löhe, Detlef. Hausselt, Jürgen. Wiley InterScience (Online service)

Preferred Shelf Number

ONLINE

Electronic Access

An electronic book accessible through the World Wide Web; click for information
Contributor biographical information http://catdir.loc.gov/catdir/enhancements/fy0627/2005283916-b.html
John Wiley http://dx.doi.org/10.1002/9783527616725

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Availability

Online Library~1

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39.

Cover image for Mechanical properties of polymers based on nanostructure and morphology

Mechanical properties of polymers based on nanostructure and morphology

Mechanical properties of polymers based on nanostructure and morphology

Author

Michler, Goerg H. (Goerg Hannes) Balta-Calleja, F. J.

Preferred Shelf Number

TA418.9 .C6 M397 2005

Electronic Access

Click here to view.

Format:

Availability

Online Library~1

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40.

Cover image for MEMS Packaging

Author

Tai-Ran Hsu, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP003E

Format:

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41.

Cover image for Strapdown Inertial Navigation Technology

Strapdown Inertial Navigation Technology

Strapdown Inertial Navigation Technology

Author

Titterton, David Weston, John

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBRA017E

Format:

Availability

Online Library~1

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42.

Cover image for Mechanical tribology : materials, characterization, and applications

Mechanical tribology : materials, characterization, and applications

Mechanical tribology : materials, characterization, and applications

Author

Totten, George E. Liang, Hong.

Preferred Shelf Number

TJ1075 .M43 2004

Electronic Access

Click here to view.

Format:

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Online Library~1

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43.

Cover image for Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Lab-on-a-chip miniaturized systems for (bio)chemical analysis and synthesis

Author

Oosterbroek, R. Edwin. Berg, A. van den (Albert)

Preferred Shelf Number

ONLINE

Electronic Access

ScienceDirect http://www.sciencedirect.com/science/book/9780444511003

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44.

Cover image for Micro flows : fundamentals and simulation

Micro flows : fundamentals and simulation

Micro flows : fundamentals and simulation

Author

Karniadakis, George. Beskok, Ali, 1966- ort. yaz.

Preferred Shelf Number

TA 357 K36 2002

Format:

Availability

Beytepe Library~1

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45.

Cover image for Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Silicon Wafer Bonding Technology for VLSI and MEMS Applications

Author

Iyer, S. S., ed. Auberton-Herv�, A. J., e

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP001E

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46.

Cover image for Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Process Technology for Silicon Carbide Devices

Author

Zetterling, Carl-Mikael, ed.

Preferred Shelf Number

ONLINE

Electronic Access

http://dx.doi.org/10.1049/PBEP002E

Format:

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Online Library~1

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47.

Cover image for The electronic packaging handbook

The electronic packaging handbook

The electronic packaging handbook

Author

Blackwell, Glenn R.

Preferred Shelf Number

TK7870.15 .E4233 2000

Electronic Access

Click here to view.

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48.

Cover image for Computational materials science the simulation of materials microstructures and properties

Computational materials science the simulation of materials microstructures and properties

Computational materials science the simulation of materials microstructures and properties

Author

Raabe, Dierk.

Preferred Shelf Number

ONLINE

Electronic Access

Click here to see page images available via Wiley.
John Wiley http://dx.doi.org/10.1002/3527601945
HathiTrust Digital Library Limited view (search only) http://catalog.hathitrust.org/api/volumes/oclc/40821147.html

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