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37. 
Cover image for Integrated Chemical Microsensor Systems in CMOS Technology
Integrated Chemical Microsensor Systems in CMOS Technology
Author 
Hierlemann, Andreas. author. Baltes, H. editor. Fujita, Hiroyuki. editor. Liepmann, Dorian. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/b138987
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38. 
Cover image for Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Multi-Gigahertz Nyquist Analog-to-Digital Converters Architecture and Circuit Innovations in Deep-Scaled CMOS and FinFET Technologies
Author 
Ramkaj, Athanasios T. author. Pelgrom, Marcel J.M. author. Steyaert, Michiel S. J. author. Tavernier, Filip. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22709-7
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39. 
Cover image for Analog and Mixed-Signal Circuits in Nanoscale CMOS
Analog and Mixed-Signal Circuits in Nanoscale CMOS
Author 
Paulo da Silva Martins, Rui. editor. Mak, Pui-In. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-031-22231-3
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40. 
Cover image for Beyond-CMOS Technologies for Next Generation Computer Design
Beyond-CMOS Technologies for Next Generation Computer Design
Author 
Topaloglu, Rasit O. editor. Wong, H.-S. Philip. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90385-9
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41. 
Cover image for CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
Author 
Wang, Jing. author. SpringerLink (Online service)
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Electronic Access 
https://doi.org/10.1007/978-981-13-3378-1
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42. 
Cover image for A New Family of CMOS Cascode-Free Amplifiers with High Energy-Efficiency and Improved Gain
A New Family of CMOS Cascode-Free Amplifiers with High Energy-Efficiency and Improved Gain
Author 
Póvoa, Ricardo Filipe Sereno. author. Goes, João Carlos da Palma. author. Horta, Nuno Cavaco Gomes. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-95207-9
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43. 
Cover image for CMOS Readout Chips for Implantable Multimodal Smart Biosensors
CMOS Readout Chips for Implantable Multimodal Smart Biosensors
Author 
Nawito, Moustafa. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-658-20347-4
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44. 
Cover image for CMOS Integrated Circuit Design for Wireless Power Transfer
CMOS Integrated Circuit Design for Wireless Power Transfer
Author 
Lu, Yan. author. Ki, Wing-Hung. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-2615-7
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45. 
Cover image for Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Radiation Hardened CMOS Integrated Circuits for Time-Based Signal Processing
Author 
Prinzie, Jeffrey. author. Steyaert, Michiel. author. Leroux, Paul. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-78616-2
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46. 
Cover image for Energy-Efficient Smart Temperature Sensors in CMOS Technology
Energy-Efficient Smart Temperature Sensors in CMOS Technology
Author 
Souri, Kamran. author. Makinwa, Kofi A.A. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-62307-8
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47. 
Cover image for 5G and E-Band Communication Circuits in Deep-Scaled CMOS
5G and E-Band Communication Circuits in Deep-Scaled CMOS
Author 
Vigilante, Marco. author. Reynaert, Patrick. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-72646-5
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48. 
Cover image for 3D TCAD Simulation for CMOS Nanoeletronic Devices
3D TCAD Simulation for CMOS Nanoeletronic Devices
Author 
Wu, Yung-Chun. author. Jhan, Yi-Ruei. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-3066-6
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