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1. 
Cover image for CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
CMOS-Compatible Key Engineering Devices for High-Speed Silicon-Based Optical Interconnections
Author 
Wang, Jing. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3378-1
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2. 
Cover image for Electromagnetic Theory and Plasmonics for Engineers
Electromagnetic Theory and Plasmonics for Engineers
Author 
Nickelson, Liudmila. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-2352-2
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3. 
Cover image for Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Proceedings of the Tiangong-2 Remote Sensing Application Conference Technology, Method and Application
Author 
Gu, Yidong. editor. Gao, Ming. editor. Zhao, Guangheng. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3501-3
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4. 
Cover image for Semi-physical Verification Technology for Dynamic Performance of Internet of Things System
Semi-physical Verification Technology for Dynamic Performance of Internet of Things System
Author 
Yu, Xiaolei. author. Wang, Donghua. author. Zhao, Zhimin. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-1759-0
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5. 
Cover image for Electromagnetic Fields and Waves Microwave and mmWave Engineering with Generalized Macroscopic Electrodynamics
Electromagnetic Fields and Waves Microwave and mmWave Engineering with Generalized Macroscopic Electrodynamics
Author 
Nefyodov, Eugene I. author. Smolskiy, Sergey M. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-90847-2
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6. 
Cover image for Manipulation of Surface Waves through Metasurfaces
Manipulation of Surface Waves through Metasurfaces
Author 
Mencagli, Mario Junior. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-14034-2
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7. 
Cover image for Microwave Active Devices and Circuits for Communication
Microwave Active Devices and Circuits for Communication
Author 
Bera, Subhash Chandra. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-3004-9
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8. 
Cover image for High-Temperature Superconducting Microwave Circuits and Applications
High-Temperature Superconducting Microwave Circuits and Applications
Author 
Liu, Haiwen. author. Ren, Baoping. author. Guan, Xuehui. author. Wen, Pin. author. Zuo, Tao. author.
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https://doi.org/10.1007/978-981-13-6868-4
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9. 
Cover image for Compact Slot Array Antennas for Wireless Communications
Compact Slot Array Antennas for Wireless Communications
Author 
Sangster, Alan J. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-01753-8
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10. 
Cover image for Last Mile Internet Access for Emerging Economies
Last Mile Internet Access for Emerging Economies
Author 
Lambrechts, Wynand. author. Sinha, Saurabh. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-030-20957-5
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11. 
Cover image for Electromagnetic Information Leakage and Countermeasure Technique Translated by Liu Jinming, Liu Ying, Zhang Zidong, Liu Tao
Electromagnetic Information Leakage and Countermeasure Technique Translated by Liu Jinming, Liu Ying, Zhang Zidong, Liu Tao
Author 
Liu, Taikang. author. Li, Yongmei. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-10-4352-9
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12. 
Cover image for 5G Green Mobile Communication Networks
5G Green Mobile Communication Networks
Author 
Ge, Xiaohu. author. Zhang, Wuxiong. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-981-13-6252-1
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