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37. 
Cover image for Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Fundamentals of Lead-Free Solder Interconnect Technology From Microstructures to Reliability
Author 
Lee, Tae-Kyu. author. Bieler, Thomas R. author. Kim, Choong-Un. author. Ma, Hongtao. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
https://doi.org/10.1007/978-1-4614-9266-5
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38. 
Cover image for Sensing Technology: Current Status and Future Trends IV
Sensing Technology: Current Status and Future Trends IV
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-12898-6
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39. 
Cover image for Sensing Technology: Current Status and Future Trends III
Sensing Technology: Current Status and Future Trends III
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-10948-0
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40. 
Cover image for Sensing Technology: Current Status and Future Trends I
Sensing Technology: Current Status and Future Trends I
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. Bhattacharyya, Nabarun. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-02318-2
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41. 
Cover image for Electronic Beam Steering and Polarization Agile Planar Antennas in Liquid Crystal Technology
Electronic Beam Steering and Polarization Agile Planar Antennas in Liquid Crystal Technology
Author 
Karabey, Onur Hamza. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-01424-1
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42. 
Cover image for Sensing Technology: Current Status and Future Trends II
Sensing Technology: Current Status and Future Trends II
Author 
Mason, Alex. editor. Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi Padmarani. editor. Bhattacharyya, Nabarun. editor. SpringerLink (Online service)
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https://doi.org/10.1007/978-3-319-02315-1
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43. 
Cover image for Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Design for Manufacturability From 1D to 4D for 90–22 nm Technology Nodes
Author 
Balasinski, Artur. author. SpringerLink (Online service)
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https://doi.org/10.1007/978-1-4614-1761-3
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44. 
Cover image for Introduction to Thin Film Transistors Physics and Technology of TFTs
Introduction to Thin Film Transistors Physics and Technology of TFTs
Author 
Brotherton, S.D. author. SpringerLink (Online service)
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ONLINE(332657.1)
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http://dx.doi.org/10.1007/978-3-319-00002-2
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45. 
Cover image for Advancement in Sensing Technology New Developments and Practical Applications
Advancement in Sensing Technology New Developments and Practical Applications
Author 
Mukhopadhyay, Subhas Chandra. editor. Jayasundera, Krishanthi P. editor. Fuchs, Anton. editor. SpringerLink (Online service)
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ONLINE(333537.1)
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http://dx.doi.org/10.1007/978-3-642-32180-1
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46. 
Cover image for Microdroplet Technology Principles and Emerging Applications in Biology and Chemistry
Microdroplet Technology Principles and Emerging Applications in Biology and Chemistry
Author 
Day, Philip. editor. Manz, Andreas. editor. Zhang, Yonghao. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-3265-4
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47. 
Cover image for Low Power RF Circuit Design in Standard CMOS Technology
Low Power RF Circuit Design in Standard CMOS Technology
Author 
Alvarado, Unai. author. Bistué, Guillermo. author. Adín, Iñigo. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-22987-9
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48. 
Cover image for Smart Sensing Technology for Agriculture and Environmental Monitoring
Smart Sensing Technology for Agriculture and Environmental Monitoring
Author 
Mukhopadhyay, Subhas C. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-27638-5
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