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37. 
Cover image for Chalcogenides Metastability and Phase Change Phenomena
Chalcogenides Metastability and Phase Change Phenomena
Author 
Kolobov, Alexander V. author. Tominaga, Junji. author. SpringerLink (Online service)
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ONLINE
Electronic Access 
http://dx.doi.org/10.1007/978-3-642-28705-3
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38. 
Cover image for Piezotronics and Piezo-Phototronics
Piezotronics and Piezo-Phototronics
Author 
Wang, Zhong Lin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-3-642-34237-0
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39. 
Cover image for Photophysics of Carbon Nanotubes Interfaced with Organic and Inorganic Materials
Photophysics of Carbon Nanotubes Interfaced with Organic and Inorganic Materials
Author 
Levitsky, Igor A. author. Euler, William B. author. Karachevtsev, Victor A. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4471-4826-5
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40. 
Cover image for Electroactivity in Polymeric Materials
Electroactivity in Polymeric Materials
Author 
Rasmussen, Lenore. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0878-9
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41. 
Cover image for Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Molecular Modeling and Multiscaling Issues for Electronic Material Applications
Author 
Iwamoto, Nancy. editor. Yuen, Matthew M.F. editor. Fan, Haibo. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1728-6
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42. 
Cover image for Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Metal-Dielectric Interfaces in Gigascale Electronics Thermal and Electrical Stability
Author 
He, Ming. author. Lu, Toh-Ming. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-1812-2
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43. 
Cover image for Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Interfacial Compatibility in Microelectronics Moving Away from the Trial and Error Approach
Author 
Laurila, Tomi. author. Vuorinen, Vesa. author. Paulasto-Kröckel, Mervi. author. Turunen, Markus. author. Mattila, Toni T. author.
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http://dx.doi.org/10.1007/978-1-4471-2470-2
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44. 
Cover image for Lead Free Solder Mechanics and Reliability
Lead Free Solder Mechanics and Reliability
Author 
Pang, John Hock Lye. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4614-0463-7
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45. 
Cover image for Reliability of Microtechnology Interconnects, Devices and Systems
Reliability of Microtechnology Interconnects, Devices and Systems
Author 
Liu, Johan. author. Salmela, Olli. author. Sarkka, Jussi. author. Morris, James E. author. Tegehall, Per-Erik. author.
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http://dx.doi.org/10.1007/978-1-4419-5760-3
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46. 
Cover image for Advanced Materials for Thermal Management of Electronic Packaging
Advanced Materials for Thermal Management of Electronic Packaging
Author 
Tong, Xingcun Colin. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-7759-5
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47. 
Cover image for Microelectronic Test Structures for CMOS Technology
Microelectronic Test Structures for CMOS Technology
Author 
Bhushan, Manjul. author. Ketchen, Mark B. author. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9377-9
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48. 
Cover image for Tip-Based Nanofabrication Fundamentals and Applications
Tip-Based Nanofabrication Fundamentals and Applications
Author 
Tseng, Ampere A. editor. SpringerLink (Online service)
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http://dx.doi.org/10.1007/978-1-4419-9899-6
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